Modular I-Bridge Flow Routing for High-Temperature Fluid Delivery

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Solution Overview

Problem

Existing fluid delivery systems for semiconductor processing and petrochemical industries face challenges in extreme flow rate and high temperature applications, where they require costly materials and complex manufacturing processes, and are not easily modifiable or reconfigurable.

Innovation Solution

A modular flow substrate design comprising an i-Block and an i-Bridge with customizable fluid pathways and mounting apertures, allowing for flexible assembly and reduced material usage, which can be coupled with standardized components to form a modular flow substrate suitable for extreme flow rates and temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional fluid delivery systems are used for extreme flow rate and high temperature applications, then the system can handle the extreme conditions, but the manufacturing cost increases and material waste increases

Engineering Contradiction:
Improveextreme flow rate and high temperature handling capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The flow substrate is divided into modular components (i-Block and i-Bridge) that can be independently manufactured and assembled. This segmentation allows each component to be optimized for specific functions while reducing overall manufacturing complexity and cost for extreme temperature applications.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standardized interface design enables the same modular components to be used across multiple applications and configurations. The i-Block and i-Bridge components can serve various fluid delivery needs in semiconductor processing, reducing the need for custom-manufactured parts for each application.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional fluid delivery systems are used, then the system can handle extreme conditions, but the system complexity increases

Engineering Contradiction:
Improveextreme flow rate and high temperature handling capabilityVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By segmenting the flow substrate into standardized modular components, the system becomes easier to configure and maintain. Each module (i-Block, i-Bridge) is a discrete unit that can be independently understood, replaced, or modified without affecting the entire system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular design allows the system configuration to be dynamically adjusted by assembling different combinations of standardized components. This enables flexible adaptation to various flow rate and temperature requirements without redesigning the entire system.

Inventive Principle:
Principle #15Dynamics

3Productivity

If existing fluid delivery systems are used, then the system can deliver process fluid, but the system is not easily modifiable or reconfigurable

Engineering Contradiction:
Improvefluid delivery capabilityVSAvoidreconfigurability
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The flow path is segmented into discrete modular components (i-Block for fluid delivery, i-Bridge for path redirection) that can be easily assembled and reconfigured. This allows rapid modification of fluid delivery paths without complex manufacturing processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standardized interfaces enable the same modular components to fulfill multiple functions across different configurations. The i-Bridge component, for example, can redirect fluid paths in various arrangements while maintaining compatibility with the same i-Block components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Loss of substance

If modular design with i-Block and i-Bridge is used, then material waste reduces and manufacturing cost decreases, but the connection complexity increases

Engineering Contradiction:
Improvematerial wasteVSAvoidconnection structure complexity
Core Design Contradiction:
Loss of substanceVSDevice complexity

Solution Approach 1:

Segmenting the design into standardized modules (i-Block, i-Bridge) with defined interfaces actually reduces overall connection complexity. Each module has predetermined connection points and standardized mounting apertures, making assembly systematic rather than ad-hoc.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular components are pre-designed with integrated fluid pathways and predetermined connection interfaces. This preliminary design work is done once during component fabrication, eliminating the need for complex field assembly operations and reducing on-site connection complexity.

Inventive Principle:
Principle #10Preliminary action

5Ease of repair

If modular flow substrate is used, then reconfiguration and maintenance become easier, but the interface complexity increases

Engineering Contradiction:
Improvemaintenance easeVSAvoidinterface complexity
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

Segmenting the flow substrate into discrete modular components (i-Block, i-Bridge) with standardized interfaces actually simplifies maintenance. Individual components can be independently removed, inspected, and replaced without affecting other parts of the system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standardized interfaces are designed to be universally compatible across all modular components. This universal interface design means that the same connection methodology applies throughout the system, reducing the variety of interface types that maintenance personnel need to understand.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240426410A1I-bridge
Publication Date: 2024.12.26 COMPART SYST PTE LTD
  • US20240426410A1 patent drawing
  • US20240426410A1 patent drawing
  • US20240426410A1 patent drawing

AI summary

A delivery system can comprise a modular flow substrate comprising an i-Block and an i-Bridge. The i-Block can comprise a first i-Block conduit port, a second i-Block conduit port, a plurality of mounting apertures, a connection depression, at least one i-Block connection aperture and a fluid pathway extending between the first i-Block conduit port and the second i-Block conduit port. The i-Bridge can comprise an i-Bridge conduit port, a manifold connection conduit port, at least one connection aperture, at least one mounting aperture, a connection protrusion, and a fluid pathway extending between the i-Bridge conduit port and the manifold connection conduit port. The connection protrusion can be sized and configured to fit within the connection depression of the i-Block.