Modular In-Grade Fixture Heat Dissipation via Segmented Heat Pipes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional in-grade lighting fixtures face challenges with heat dissipation, leading to reduced light emission and component failure due to operational temperature issues, and lack flexibility in servicing or upgrading internal components without labor-intensive replacement.
Innovation Solution
An in-grade lighting fixture with a heat sink assembly that dissipates heat through a thermally conductive housing and heat pipes, allowing for adjustable light emission and easy servicing or upgrading of components without removing the fixture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional in-grade lighting fixtures are used with enclosed housings, then protection from environmental damage is improved, but heat dissipation deteriorates leading to component failure
Solution Approach 1:
The housing is divided into modular sections (optical chamber, electronic component chamber, heat sink assembly) that can be independently serviced. The heat dissipation system is segmented into heat pipes, heat sinks, and thermal pathways that can be separately maintained or replaced without replacing the entire fixture.
Solution Approach 2:
Heat pipes serve as intermediary thermal transfer devices between the LED light source and the heat sink assembly. These heat pipes conduct heat away from the light source through phase change mechanisms, acting as a thermal mediator that protects components while enabling effective heat dissipation.
2Illumination intensity
If high power LEDs are used to increase light output, then illumination intensity is improved, but heat generation worsens causing reduced light emission and component failure
Solution Approach 1:
The system changes thermal parameters through the heat dissipation assembly, maintaining optimal operating temperature for high power LEDs. By actively managing thermal parameters via heat pipes and heat sinks, the system enables higher power LED operation without exceeding temperature thresholds that would reduce light emission or cause failure.
Solution Approach 2:
The system converts the harmful heat generated by high power LEDs into a manageable thermal flow that can be directed through heat pipes to heat sinks. The heat that would otherwise cause component failure is redirected through thermal pathways to the heat dissipation assembly, where it is safely transferred to the surrounding environment.
3Device complexity
If the housing extends deep into the ground to accommodate all components, then component containment is improved, but installation and servicing complexity worsens
Solution Approach 1:
The housing is segmented into multiple accessible chambers (optical chamber for LED and lens, electronic component chamber for ballasts and capacitors, and heat sink assembly). Each chamber can be independently accessed and serviced through separate openings, eliminating the need to excavate deep to reach specific components.
Solution Approach 2:
The system transitions from vertical depth-based component arrangement to horizontal/planar distribution of functional chambers. Components are arranged in separate lateral sections rather than stacked vertically deep in the ground, allowing surface-level access to all chambers without extensive excavation.
4Ease of manufacture
If the fixture is designed as a single integrated unit, then manufacturing simplicity is improved, but adaptability for different applications and future upgrades deteriorates
Solution Approach 1:
The fixture is designed as a modular assembly of standardized chambers (optical chamber, electronic component chamber, heat sink assembly) that can be manufactured separately and assembled. This segmentation enables independent manufacturing optimization for each module while allowing flexible reconfiguration and upgrading of individual chambers without replacing the entire fixture.
Solution Approach 2:
The modular chamber design provides universal interfaces and standardized mounting configurations that can accommodate different LED types, ballast configurations, and heat sink designs. Each chamber is designed with universal mounting features allowing various components to be installed and upgraded while maintaining compatibility with the overall fixture structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation, enabling higher output power for LEDs while preventing component failure and allowing for flexible installation and maintenance, reducing the need for full fixture replacement.
Implementation Method 1
a heat sink assembly in thermal communication with at least one inner surface of the upper portion of the housing... The heat sink assembly transfers heat from the light source away from the light source and into a cooler condensing unit of the heat sink assembly
Implementation Method 2
The heat sink assembly can comprise one or more LEDs mounted on a heat sink and one or more heat pipes, wherein the one or more heat pipes are in thermal communication with the heat sink and the housing
Data Source
AI summary
The disclosure described herein is directed to an in-grade lighting fixture with improved heat dissipation that provides greater flexibility in servicing, replacing, or installing internal components within the fixture. The in-grade lighting fixture comprises features to assist in dissipating heat generated by light sources, such as LEDs, and/or other electronic components to optimize performance and allow for increased output power for the light sources. The disclosure uses a heat sink assembly that is in thermal communication with the in-grade lighting fixture in order to dissipate heat within the lighting fixture out to the ambient, which optimizes performance and allows for increased output power for the light source.


