Modular Inductive Sensor Circuit Boards
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Solution Overview
Problem
Existing inductive sensors face challenges in accommodating different electric motor or generator configurations without requiring modifications to the interconnect assembly, as the location of interconnect points must remain fixed for various coil configurations.
Innovation Solution
The inductive sensor design includes a first circuit board with a sensor element configurable in multiple coil configurations and a second circuit board with processing circuitry, both with fixed interconnect points aligned along the circumferential and radial directions, allowing for interchangeable configurations without modifying the interconnect assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sensor element is designed with fixed interconnect points to maintain consistent positioning, then the reliability of electrical connection is improved, but the adaptability to different coil configurations deteriorates
Solution Approach 1:
The circuit board is segmented into multiple layers with the sensor element on a first set of layers and processing circuitry on a second set of layers, separated by an intermediate third set of layers. This segmentation allows the sensor element to maintain fixed interconnect points while accommodating different coil configurations through the multi-layer structure.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional multi-layer configuration. By stacking circuit boards with sensor elements, processing circuitry, and intermediate layers, the design achieves both fixed interconnect points and configuration flexibility through the additional vertical dimension.
2Object-affected harmful factors
If the circuit board uses a multi-layer structure with intermediate layers between sensor element and processing circuitry, then the electromagnetic shielding and signal integrity are improved, but the device complexity increases
Solution Approach 1:
An intermediate third set of layers is introduced between the sensor element (first set of layers) and the processing circuitry (second set of layers). This intermediate layer acts as a mediator that provides electromagnetic shielding and signal routing capabilities, reducing interference while maintaining a structured and manageable design.
3Ease of manufacture
If the interconnect points are positioned at the same location for all configurations, then the ease of manufacturing is improved, but the versatility for different motor or generator configurations deteriorates
Solution Approach 1:
The circuit board design implements universality by positioning interconnect points at fixed locations that can accommodate multiple sensor element configurations. The same physical interconnect points serve multiple functional purposes across different motor or generator applications, eliminating the need for configuration-specific interconnect assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the inductive sensor to seamlessly adapt to different electric motor or generator configurations by maintaining fixed interconnect points, facilitating easy swapping of circuit boards and preventing electromagnetic coupling with external metal components.
Implementation Method 1
The transmit coil is configured to induce an electrical current in the plurality of receive coils via a target
Data Source
AI summary
An inductive sensor includes a first circuit board having a sensor element configurable in a plurality of different coil configurations. The sensor element includes a transmit coil and a plurality of receive coils. The first circuit board includes interconnect points positioned at a same location on the first circuit board for each of the plurality of different coil configurations. The inductive sensor includes a second circuit board spaced apart from the first circuit board along the axial direction. The second circuit board includes processing circuitry associated with the sensor element and configurable in a plurality of different configurations. The second circuit board includes interconnect points positioned at a same location on the second circuit board for each of the configurations of the processing circuitry. Furthermore, each interconnect point on the second circuit board is aligned with a corresponding interconnect point on the first circuit board along circumferential and radial directions.