Modular Injection Mold Manifold for Stack Molds
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Solution Overview
Problem
Traditional injection molding systems require significant downtime and capital investment for changing mold and runner configurations to accommodate different labeling requirements, making them uneconomical for markets with varying labeling needs, especially when switching between hot tip and valve gate designs.
Innovation Solution
A modular injection mold and manifold system for multi-level stack molds that allows for interchangeable mold sets and runners between hot tip and valve gate designs, featuring discrete melt paths and separable connectors, enabling easy configuration changes without disrupting adjacent levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dedicated mold and runner arrangements are used for specific labeling requirements, then manufacturing precision and reliability are improved, but adaptability deteriorates and significant downtime is required for changeover
Solution Approach 1:
The injection mold system is divided into separate modular components: mold sets and runner systems can be independently exchanged. The manifold is segmented into multiple inlet ports that can accommodate different runner configurations (hot tip or valve gate), allowing precise matching of runner type to labeling requirements without replacing the entire system.
Solution Approach 2:
The manifold is designed with universal adaptability to accept both hot tip and valve gate runner systems through multiple inlet ports. This multi-functional design allows a single manifold to serve different labeling configurations, eliminating the need for dedicated runner systems for each labeling requirement while maintaining manufacturing precision.
2Manufacturing precision
If dedicated mold sets are designed for specific parts, then manufacturing precision is improved, but device complexity and capital investment increase
Solution Approach 1:
The system separates mold sets from runner systems, allowing each to be optimized independently. Mold sets maintain precision for specific parts while runner systems provide flexible configuration through modular exchange rather than complex integrated designs.
3Reliability
If traditional mold changeover procedures are used, then reliability is maintained, but loss of time increases significantly
Solution Approach 1:
By separating mold sets and runner systems into independently exchangeable modules, the changeover process is simplified to straightforward module replacement rather than complex reconfiguration, maintaining reliability while dramatically reducing changeover time.
Solution Approach 2:
Multiple runner systems (hot tip and valve gate) are pre-configured and ready for exchange. The manifold is pre-designed with multiple inlet ports to accommodate different runner types, allowing rapid switching without on-site reconfiguration or complex assembly procedures.
4Manufacturing precision
If valve gate hot runner systems are used, then manufacturing precision for labeled parts is improved, but device complexity and cost increase
Solution Approach 1:
Valve gate hot runner systems are deployed selectively only at locations where label protection is required, rather than throughout the entire system. The modular manifold allows local implementation of valve gate technology at specific inlet ports while other ports can use simpler hot tip systems.
Solution Approach 2:
The manifold serves as a universal platform that can accommodate both valve gate and hot tip runner systems, allowing the complexity of valve gate technology to be applied only where necessary for label protection while maintaining simplicity elsewhere in the system.
Data Source
AI summary
A molding arrangement is provided for multi-level stack molds wherein mold sets and runners are made up of modular sections interchangeable individually or as larger assemblies for exchanging molds for one part for those for different parts or exchanging runners between hot tip and valve gate designs to accommodate different molding arrangements. The arrangement has discrete melt paths for each mold level, at least some of which extend around rather than through the mold levels and which incorporate readily separable connectors. This enables one set of molds and possibly as well the runners for one mold level to be interchanged without interfering with the mold and runner arrangement for an adjacent level.