Modular Intelligent Electronic Device for Substation Automation

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Solution Overview

Problem

Existing intelligent electronic devices in substation and distribution automation systems lack flexibility in hardware and software configurations, making it difficult to adapt to varying environmental requirements such as different I/O connections and communication protocols, while adhering to standards like IEC 61850.

Innovation Solution

A modular intelligent electronic device with mechanically separable and replaceable hardware modules interconnected via an inter-module bus, including a communication module for network communication and I/O modules for local equipment, allowing user-selectable configurations that follow the IEC 61850 standard, enabling flexible hardware and software combinations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional fixed-configuration intelligent electronic devices are used, then device stability and standard compliance are maintained, but flexibility and adaptability to varying environmental requirements deteriorate

Engineering Contradiction:
ImproveflexibilityVSAvoidconfiguration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The IED is divided into multiple functional modules (power supply module, communication module, processing module, I/O module) that can be independently selected and configured. Each module performs a specific function and can be combined with other modules to create different device configurations suitable for various application environments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular architecture enables a single IED platform to serve multiple functions and applications. By selecting different combinations of modules, the same base device can be adapted for protection, monitoring, control, and communication tasks across different electrical systems and environments.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If modular hardware is implemented to improve flexibility, then adaptability to different environments is improved, but device complexity and integration difficulty worsen

Engineering Contradiction:
Improveenvironmental adaptabilityVSAvoidintegration ease
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The device is segmented into standardized modules with defined interfaces and communication protocols. This segmentation allows each module to be manufactured, tested, and validated independently, then integrated into the complete IED system through standardized connection mechanisms.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Standardized communication buses and interface protocols act as intermediaries between modules, enabling seamless data exchange and coordination. The inter-module communication infrastructure mediates interactions between power supply, processing, I/O, and communication modules, simplifying integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS8341304B2Flexible intelligent electronic device
Publication Date: 2012.12.25 ABB (SCHWEIZ) AG
  • US8341304B2 patent drawing
  • US8341304B2 patent drawing
  • US8341304B2 patent drawing

AI summary

An intelligent electronic device for a Substation Automation or Distribution Automation system as well as to a method and computer program product for providing it. The device has a structuring of its own functionality according to a communication standard and includes mechanically separable, replaceable hardware modules interconnected via an inter-module bus. The modules implement functionality related to function related elements of the standard and include a communication module and I/O modules. The device includes elements of the communication standard comprising one device related element and replaceable function related elements of all the functions provided by the modules. The communication module includes the device related element and function elements associated with the function of the communication module as well as functions provided by all the I/O modules.