Modular Interconnect System with Removable Backshells

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Solution Overview

Problem

Stacked interconnects in electronic systems are difficult to access and repair, especially when damaged components are located in the middle or bottom of the stack, leading to increased disassembly and reassembly time and costs.

Innovation Solution

An electrical connector system with interconnects arranged in a stacked configuration, where each interconnect has a removable backshell that can be uncoupled from the connector body without disrupting the entire stack, allowing for individual component repair while maintaining the stacked arrangement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If interconnects are placed in a stacked arrangement to save space, then the compactness of the system is improved, but the ease of access and repair of individual interconnects deteriorates

Engineering Contradiction:

Improvesystem compactnessVSAvoidinterconnect accessibility

Core Design Contradiction:

Volume of moving objectVSEase of repair

Solution Approach 1:

The interconnect assembly is segmented into modular units where each interconnect can be independently accessed. The stackable design with standardized interfaces allows individual interconnects to be separated from the stack for repair while maintaining the compact stacked arrangement for operational components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system transitions from a static fixed arrangement to a dynamic reconfigurable stack where interconnects can be added, removed, or accessed individually. The standardized mechanical and electrical interfaces enable dynamic reconfiguration without compromising the compact stacked structure.

Inventive Principle:

Principle #15Dynamics

2Volume of moving object

If interconnects are stacked in close proximity to reduce space, then the space utilization is improved, but the time required for disassembly and reassembly during repair increases

Engineering Contradiction:

Improvespace utilizationVSAvoidrepair time

Core Design Contradiction:

Volume of moving objectVSLoss of time

Solution Approach 1:

The interconnects are pre-configured with standardized interfaces and alignment features that enable quick identification and engagement. The preliminary design of the stackable structure with built-in guides and locking mechanisms reduces the time required for disassembly and reassembly during repair operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

By segmenting the interconnect system into independent modular units with standardized interfaces, the repair process can focus on individual components rather than disassembling the entire stack, significantly reducing repair time while maintaining compact space utilization.

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If multiple interconnects are stacked to meet system requirements, then the system functionality is improved, but the complexity of accessing and repairing individual components increases

Engineering Contradiction:

Improvesystem functionalityVSAvoidassembly complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The interconnects are designed with universal standardized interfaces that allow them to function both individually and as part of a stacked assembly. The same mechanical and electrical interface standards enable individual interconnects to be used separately or stacked in various configurations, reducing the complexity of accessing and repairing components while maintaining system functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Volume of moving object

If interconnects are placed in a compact stacked arrangement, then the system compactness is improved, but the number of parts that must be removed for repair increases

Engineering Contradiction:

Improvesystem compactnessVSAvoidnumber of parts removed

Core Design Contradiction:

Volume of moving objectVSLoss of substance

Solution Approach 1:

The stackable interconnect design segments the assembly into independent modular units with standardized interfaces. This allows individual interconnects to be removed from the stack for repair without requiring the removal of surrounding components, thereby reducing the number of parts that must be handled during repair while maintaining system compactness.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS7494384B2Modular interconnect system and apparatus

Publication Date: 2009.02.24 DEUT ENGINEERED CONNECTING DEVICES

AI summary

Systems and apparatuses are provided for placing interconnects or connector modules into stacked arrangements, wherein individual interconnects or connector modules can be readily accessed and repaired without disrupting the stacked arrangement. In one embodiment, the electrical connector system has a plurality of interconnects mounted together in a stacked arrangement. Each of the interconnects comprises a connector body and a backshell removably coupled to the connector body, wherein the backshell is configured to receive and retain a overbraid. Each backshell is designed to be uncoupled from the connector body while retaining the plurality of interconnects in the stacked arrangement, thereby making is possible to repair single a interconnect without disrupting the others.