Modular Interconnect for CPU I/O Flexibility
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Solution Overview
Problem
Existing electronics enclosures with a 'one-size-fits-all' CPU module design struggle to efficiently support diverse products due to unnecessary components and reduced performance from fixed interconnectivity between CPU and I/O modules, leading to unsatisfactory compromises in cost and functionality.
Innovation Solution
A modularized interconnect system featuring pluggable, field-replaceable interconnect modules that provide serialized communication paths between CPU and I/O modules, allowing for tailored interconnectivity designs and hot-swappable components, eliminating the need for a fixed midplane and enabling flexible communication technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a fixed midplane design is used to connect CPU modules and I/O modules, then the interconnectivity is predetermined and manufacturing is simplified, but the adaptability to different product requirements is reduced
Solution Approach 1:
The fixed midplane is segmented into separate pluggable interconnect modules that can be independently selected and configured. Each interconnect module provides specific connectivity patterns, allowing the system to be customized for different product requirements while maintaining modular assembly simplicity.
Solution Approach 2:
Multiple interconnect module designs are created to serve different product configurations. These modules can be swapped based on whether peer-to-peer communication, fan-out switching, or direct routing is needed, making a single CPU module design adaptable to multiple product scenarios.
2Device complexity
If a one-size-fits-all CPU module design is used, then the number of CPU module variants is reduced, but unnecessary components are included increasing cost
Solution Approach 1:
The interconnect functionality is extracted from the CPU module and placed in separate pluggable interconnect modules. This allows the CPU module to be simplified to a base design without unnecessary components, while specific features like protocol switches or fan-out capabilities are added only when needed through the interconnect module.
Solution Approach 2:
The system transitions from a static, fixed interconnect architecture to a dynamic, reconfigurable one where interconnect modules can be changed based on product requirements. This allows the same CPU module to adapt to different functionality needs by simply swapping the interconnect module.
3Adaptability or versatility
If fan-out switching is implemented to increase connectivity for I/O modules, then the number of available lanes is increased, but system performance is reduced
Solution Approach 1:
Instead of universally applying fan-out switching to all systems, the interconnect modules allow selective implementation of fan-out capability only where needed. High-performance systems can use direct routing without fan-out switches, while systems requiring high I/O connectivity can select interconnect modules with fan-out switching.
4Adaptability or versatility
If protocol switches with non-transparent ports are included for peer-to-peer communication, then CPU module peer-to-peer capability is enabled, but cost increases for products that don't need this feature
Solution Approach 1:
The protocol switch functionality is extracted from the CPU module and placed in the pluggable interconnect module. This allows peer-to-peer communication capability to be added only when needed, without including it in the base CPU module design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a flexible and cost-effective design that tailors interconnectivity to specific product needs, reducing unnecessary components and enhancing performance by allowing customization of interconnect modules for various products within a family, while enabling hot-swapping and improved communication efficiency.
Implementation Method 1
Each lane contains two pairs of wires: one pair for receiving low-voltage differential signals and the other pair for transmitting low-voltage differential signals
Data Source
AI summary
Described are electronics enclosures having an I/O (input/output) module, a CPU (central processing unit) module having a root complex, and a pluggable, field-replaceable interconnect module electrically connected to the root complex of the CPU module by a first set of differential signal pairs and to the I/O module by a second set of differential signal pairs. The field-replaceable interconnect module provides a serialized communication path between the first and second sets of differential signal pairs for carrying serialized differential signaling corresponding to communications exchanged between the root complex of the CPU module and the I/O module.