Modular Interconnect Testing Under Force and Temperature Variation
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Solution Overview
Problem
Conventional testing systems are unable to efficiently test a variety of semiconductor chips with different electrical interconnects and DUT PCBs, requiring dedicated machines for each type, occupying valuable cleanroom space and being costly and inflexible.
Innovation Solution
A modular testing system with compressible electrical contacts and an environmental chamber that allows quick conversion between configurations for testing different electrical interconnects and DUT PCBs, capable of operating under extreme temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional testing systems are used for each type of electrical interconnect, then testing accuracy is maintained, but cleanroom space is consumed and capital costs increase
Solution Approach 1:
The testing system employs a universal testing platform that can accommodate multiple types of electrical interconnects and DUT PCBs through configurable test fixtures and modular components. The system uses programmable test equipment and interchangeable test sockets that can be rapidly reconfigured to match different interconnect types, eliminating the need for dedicated testing machines for each type while maintaining testing accuracy.
Solution Approach 2:
The testing system is divided into modular components including separate test fixtures, interchangeable sockets, and configurable test equipment. Each module can be independently selected and combined to create the appropriate testing configuration for different interconnect types, allowing flexible space utilization and reduced capital costs while maintaining reliability.
2Reliability
If dedicated testing machines are created for each electrical interconnect type, then testing capability is optimized, but device complexity and capital costs increase
Solution Approach 1:
The system uses a universal testing platform with programmable control and interchangeable test fixtures that can be configured to test various electrical interconnect types. The test equipment features automated configuration capabilities that reduce the complexity of switching between different test setups while maintaining optimized testing capability for each interconnect type.
Solution Approach 2:
The testing system incorporates dynamically reconfigurable components including programmable test fixtures and interchangeable sockets that can be quickly changed between different interconnect types. The system includes automated configuration software that dynamically adjusts test parameters and fixture arrangements, reducing manual complexity while maintaining specialized testing capability.
3Reliability
If multiple dedicated testing systems are maintained, then each interconnect type can be tested optimally, but loss of time for conversion between configurations increases
Solution Approach 1:
The testing system uses segmented, modular test fixtures and interchangeable sockets that can be rapidly swapped between different interconnect types. The modular design allows for quick reconfiguration without requiring complete system redesign, significantly reducing conversion time while maintaining optimized testing capability for each interconnect type.
Solution Approach 2:
The system incorporates dynamically reconfigurable test fixtures and automated setup procedures that enable rapid switching between different interconnect types. The programmable control system automatically configures test parameters when new fixtures are installed, eliminating manual reconfiguration time and maintaining testing optimization across different interconnect types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides flexible, accurate, and cost-effective testing of multiple semiconductor chips with minimal space requirements, enabling efficient use of cleanroom space and reducing capital costs.
Implementation Method 1
compressible electrical contacts
Implementation Method 2
environmental chamber configured to control temperature
Data Source
AI summary
A method of use of the testing system having an electrical interconnect attached to an electrical interconnect testing device, a device under test aligned with the electrical interconnect, and an environmental chamber. The method comprising positioning the environmental chamber such that the device under test is operably contained within the environmental chamber, setting the environmental chamber to a first temperature, pressing down on the device under test with a plurality of different levels of force, or to a plurality of different positions, and taking at least one measurement of at least one electrical property while the device under test is pressed down. In various arrangements, the method of use further including the steps of adjusting the temperature within the environmental chamber to a second temperature and repeating the steps of pressing down on the device under test and taking at least one measurement of at least one electrical property.