Modular Interconnect for High-Frequency PCB Signal Transmission
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Solution Overview
Problem
Existing electrical interconnects for printed circuit boards (PCBs) lack efficiency and flexibility in high-frequency signal transmission and customization for varying frequency and power requirements.
Innovation Solution
A modular interconnect system comprising a frame with coaxial modules, guide modules, and header assemblies that allow for snap-in connections, enabling secure and customizable transmission between PCBs, with coaxial modules housing signal and ground contacts for efficient high-frequency signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrical interconnects are used for PCB transmission, then the structure is simple and ease of manufacture is improved, but signal transmission efficiency and electromagnetic interference protection deteriorate at high frequencies
Solution Approach 1:
The interconnect system is divided into modular components including coaxial modules, guide modules, and header assemblies that can be independently manufactured and then assembled together. Each module contains specific functional elements (signal contacts, ground contacts, housings) that can be produced separately using optimized processes, reducing overall manufacturing complexity while maintaining high-frequency performance through precise modular integration.
Solution Approach 2:
The coaxial modules are designed with nested structures where signal contacts and ground contacts are positioned concentrically within housings, creating coaxial geometries that provide inherent electromagnetic shielding. This nested arrangement allows multiple functional elements to be integrated within compact module boundaries, maintaining signal integrity while simplifying the overall assembly process.
2Adaptability or versatility
If fixed interconnect designs are used, then manufacturing precision is improved, but adaptability for varying frequency and power requirements deteriorates
Solution Approach 1:
The interconnect system employs modular components that can be dynamically configured to match different frequency and power requirements. Coaxial modules with varying impedance characteristics (50 ohm, 75 ohm, 100 ohm) and different power handling capabilities can be selected and assembled in different combinations, allowing the system to adapt to various application requirements while maintaining precise electrical characteristics through standardized interface designs.
Solution Approach 2:
The modular architecture enables universal interfaces that can accommodate multiple function types within the same physical framework. Guide modules can direct signals for different frequencies, header assemblies can accommodate various contact configurations, and coaxial modules can be arranged in different patterns, all using standardized mounting interfaces that maintain manufacturing precision across different configurations.
3Object-affected harmful factors
If modular coaxial modules are implemented, then electromagnetic interference protection and signal transmission are improved, but device complexity increases
Solution Approach 1:
Multiple functional elements are merged into integrated coaxial modules that combine signal transmission, ground reference, and electromagnetic shielding in single assembled units. Each module integrates signal contacts, ground contacts, and protective housings into a unified structure that provides inherent EMI protection through coaxial geometry, reducing the need for separate shielding components and simplifying the overall system architecture.
Solution Approach 2:
The interconnect system utilizes three-dimensional spatial arrangement of coaxial modules within the frame structure to provide EMI protection without increasing planar complexity. By arranging modules in vertical and horizontal dimensions with proper grounding and shielding orientations, the system achieves comprehensive electromagnetic protection while maintaining a compact footprint and manageable assembly complexity.
Data Source
AI summary
The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.