Modular Interconnect Repair for Multi-Die Packages
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Solution Overview
Problem
Integrated circuit devices often experience incomplete or flawed interconnections between die, which can lead to functionality issues, and existing solutions struggle to efficiently repair these connections without increasing manufacturing complexity or cost.
Innovation Solution
A modular interconnect repair system that remaps connections from outside the die to internal points, utilizing a remapping controller to shift functionalities until a redundant point is reached, enabling functional recovery and improving assembly yield by converting single-ended IOs to differential IOs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interconnect repair is performed using traditional methods, then connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The interconnect repair function is segmented into modular components: remapping controllers on individual die, lookup tables for mapping relationships, and hierarchical repair levels (intra-die and inter-die). This modular segmentation allows repair functionality to be distributed and managed independently, reducing overall manufacturing complexity while maintaining reliability.
Solution Approach 2:
Repair mapping tables and remapping configurations are pre-computed and stored during manufacturing testing. The remapping controllers are pre-programmed with alternative connection paths before the product reaches the customer. This preliminary action eliminates the need for complex real-time repair operations, simplifying manufacturing processes.
2Reliability
If interconnect repair is performed using traditional methods, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The system performs self-diagnosis and self-repair through automated remapping controllers that detect failed interconnects and automatically reroute signals through alternative paths. This self-service capability eliminates the need for manual repair operations and reduces labor costs, making the manufacturing process more economical while maintaining high reliability.
Solution Approach 2:
The remapping system dynamically changes connection parameters (mapping relationships) based on detected failures. By altering the logical mapping between physical interconnects and functional endpoints, the system recovers functionality without physical rework, reducing manufacturing costs associated with traditional repair methods.
3Adaptability or versatility
If remapping is performed across multiple die, then interconnect recovery capability is improved, but device complexity increases
Solution Approach 1:
The remapping controllers are designed with universal functionality to handle both intra-die and inter-die remapping operations. The same controller architecture and mapping mechanisms are used across different die types and connection scenarios, reducing the need for specialized complex circuits for each repair scenario and simplifying overall device design.
Solution Approach 2:
The remapping system employs nested hierarchical structures where lookup tables are nested within remapping controllers, which are nested within the multi-die package architecture. This nesting allows complex inter-die remapping functionality to be built from simpler modular components, reducing overall device complexity while maintaining high recovery capability.
Data Source
AI summary
An integrated circuit device or devices is presented that include internal connection ports to transmit data to or receive data from a first portion of the integrated circuit device. The integrated circuit device(s) also include external connection ports to transmit data to or receive data from outside the integrated circuit device, such as between integrated circuit devices. The integrated circuit device also includes remapping circuitry that remaps from a first connection between a first internal connection port of the internal connection ports and a first external connection port of the external connection ports to a second connection between a second internal connection port of the internal connection ports and a second external connection port of the external connection ports.