Modular Interconnection Unit With Flat Bump Protection for POP Yield
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Solution Overview
Problem
The semiconductor industry faces challenges in manufacturing Package-on-Package (POP) assemblies due to the complexity of the process and low yield, primarily caused by vacuum leakage during the pick-and-place process of modular interconnection units.
Innovation Solution
A modular interconnection unit is designed with a protection layer covering the conductive bumps, featuring a flat upper surface to prevent vacuum leakage, thereby improving the pick-and-place process and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive bumps are raised from the dielectric layer surface to enable electrical connection, then electrical connectivity is achieved, but vacuum leakage occurs during pick-and-place process
Solution Approach 1:
A protection layer is formed over the raised conductive bumps before the pick-and-place process. This preliminary protective action creates a flat upper surface that prevents vacuum leakage during grasping, while the conductive bumps remain intact for subsequent electrical connection. The protection layer is later removed only from necessary areas after mounting.
2Productivity
If a protection layer is added to cover conductive bumps, then vacuum leakage is prevented, but device structure becomes more complex
Solution Approach 1:
The protection layer is applied selectively only where needed - covering the upper surfaces of raised conductive bumps and portions of the dielectric layer surrounding them. This localized approach prevents vacuum leakage without adding unnecessary complexity to the entire device structure. The protection layer is later removed from specific areas to expose conductive bumps for connection.
Data Source
AI summary
A modular interconnection unit, a semiconductor package and a method for making the same are provided. The method includes: providing a first sub-package including a first substrate, at least one first interconnection pattern, and at least one first electronic component; mounting at least one modular interconnection unit on the first substrate, wherein the modular interconnection unit includes a dielectric layer, at least one conductive via passing through the dielectric layer, at least one conductive bump raised from an upper surface of the dielectric layer, and a protection layer covering the conductive bump and having a flat upper surface, and the conductive via is electrically coupled with the first interconnection pattern; forming a first encapsulant on the upper surface of the first substrate; removing a portion of the protection layer to expose an upper surface of the conductive bump; and mounting a second sub-package above the first encapsulant.