Modular Interference Suppression for Electronic Subassemblies
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Solution Overview
Problem
Existing interference suppression systems for electronic components in electric vehicles often fail to meet individual EMC requirements due to their design focusing on the entire vehicle rather than specific components, leading to inadequate or excessive radiation suppression.
Innovation Solution
A scalable interference suppression apparatus for electronic subassemblies featuring capacitance and inductance modules connected in series, with common-mode chokes and capacitors strategically arranged to address varying EMC requirements, allowing for precise adjustment and efficient electromagnetic screening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire electronic apparatus is subject to EMC requirements with comprehensive screening, then EMC compliance is improved, but device complexity and cost increase
Solution Approach 1:
The interference suppression apparatus is divided into modular components (capacitance modules with first, second, and third capacitors; inductance modules with common-mode chokes) that can be independently selected and combined. This segmentation allows targeted suppression at specific locations rather than comprehensive screening of the entire apparatus, reducing overall complexity while maintaining EMC compliance.
Solution Approach 2:
The patent applies interference suppression components locally at the electronic subassembly level where high-voltage poles are present, rather than implementing universal screening across the entire vehicle. This localized approach focuses resources on critical areas generating electromagnetic interference, improving cost-effectiveness and reducing unnecessary complexity in low-risk areas.
2Ease of manufacture
If a fixed interference suppression design is used for all vehicles, then manufacturing simplicity is improved, but adaptability to different EMC requirements deteriorates
Solution Approach 1:
The interference suppression system is designed with dynamic configurability through modular capacitance and inductance modules that can be selectively assembled based on specific vehicle EMC requirements. This allows the same basic module design to be adapted to different suppression levels and configurations, maintaining manufacturing simplicity through standardized components while achieving versatility in application.
Solution Approach 2:
The capacitance modules and inductance modules are designed as universal building blocks that can serve multiple EMC suppression functions across different vehicle types and applications. The same module designs can be configured in various quantities and arrangements to meet different EMC standards, eliminating the need for completely different designs for each application.
3Object-affected harmful factors
If more capacitance and inductance modules are installed to suppress strong radiation, then EMC suppression effectiveness is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent implements a scalable approach where the number of capacitance and inductance modules is optimized based on actual EMC requirements. Rather than installing a fixed excessive number of modules in all applications, the system uses the minimum necessary quantity to achieve compliance, allowing partial implementation for low-radiation applications and more comprehensive implementation for high-radiation applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides adaptable, cost-effective, and space-efficient interference suppression, ensuring compliance with EMC standards by allowing the number of modules to be adjusted based on radiation characteristics, reducing development and component costs, and enhancing electromagnetic compatibility.
Implementation Method 1
at least one common-mode choke wound around the positive high-voltage pole and the negative high-voltage pole
Implementation Method 2
at least one first capacitor via which the positive high-voltage pole is connected to ground, at least one second capacitor via which the negative high-voltage pole is connected to ground
Data Source
AI summary
The invention relates to an interference suppression apparatus (100) for an electronic component, having a positive high-voltage pole (108) and a negative high-voltage pole (109), having at least one capacitance module (101; 101′, 101″) with in each case at least one first capacitor (103), via which the positive high-voltage pole (108) is connected to earth, and at least one second capacitor (104), via which the negative high-voltage pole (109) is connected to earth, and at least one third capacitor (107) which is connected between the positive high-voltage pole (108) and the negative high-voltage pole (109); and/or at least one inductance module (102) with in each case at least one common-mode inductor (112) which is wound around the positive high-voltage pole (108) and the negative high-voltage pole (109); wherein the capacitance modules (101; 101′, 101″) and/or inductance modules (102) are connected in series.