Modular Interposer LED Display Layout for Flexible High-Density Panels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display technologies face challenges in manufacturing cost and flexibility due to the miniaturization of semiconductor light emitting elements, making it difficult to produce a large number of elements on a substrate, especially for small, multi-type, and transparent/flexible displays.
Innovation Solution
A display device configuration using a base substrate with modular interposers, where a first interposer includes a semiconductor light emitting element and an IC chip, and a second interposer includes a row driver and/or column driver, allowing for efficient signal distribution and miniaturization of elements for flexible and bezel-less displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor light emitting elements are miniaturized to increase the number of elements on a substrate, then the quantity of elements increases, but the manufacturing difficulty and cost increase
Solution Approach 1:
The patent divides the driving substrate into multiple modular interposer units, each capable of independently driving a portion of the semiconductor light emitting elements. This segmentation allows for standardized mass production of interposers and enables flexible configuration to match different quantities and arrangements of miniaturized light emitting elements, thereby reducing manufacturing difficulty while supporting high element density.
2Manufacturing precision
If the initial development cost for manufacturing a driving substrate is large, then manufacturing precision can be maintained, but the adaptability to various products decreases
Solution Approach 1:
The patent designs interposers with universal interfaces and standardized configurations that can accommodate different types and quantities of semiconductor light emitting elements. The modular interposer structure serves multiple functions: it provides precise driving signals, supports various display configurations (small-type, multi-type, transparent/flexible), and enables mass production through standardization, thereby achieving both manufacturing precision and product adaptability.
3Length of moving object
If semiconductor light emitting elements are miniaturized, then the size of individual elements decreases, but the complexity of circuit configuration increases
Solution Approach 1:
The patent segments the complex circuit configuration into multiple standardized interposer modules, each handling a specific portion of the driving signals. This modular approach simplifies the overall circuit design by breaking down the complexity into manageable, repeatable units that can be systematically arranged to match the miniaturized light emitting element layout, thereby reducing circuit configuration complexity while supporting element miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the production of flexible, bezel-less displays with improved yield and pass/fail inspection capabilities, addressing the challenges of miniaturization and manufacturing costs by optimizing the placement and functionality of interposers on the substrate.
Implementation Method 1
LED (light emitting diode), which is a well-known semiconductor light-emitting element that converts electric current into light
Implementation Method 2
semiconductor light-emitting element that converts electric current into light
Data Source
AI summary
The present disclosure relates to a display apparatus using a semiconductor light-emitting device, the display apparatus comprising: a base substrate; a row driver which provides 3-state first signals including a high, a ground, and a low signal; a column driver which provides 2-state second signals including a high and a low signal; and a plurality of semiconductor light-emitting devices provided on the base substrate, wherein the plurality of semiconductor light-emitting devices include a first semiconductor light-emitting device and a second semiconductor light-emitting device which are connected to the row driver and the column driver in different pole directions.