Modular Inverter Cooling with Parallel Gas Flow
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Solution Overview
Problem
Existing inverter cooling systems with a flat, non-modular design suffer from uneven cooling effects across components and inconvenient installation due to series cooling arrangements, where cooling air does not simultaneously flow through all units, leading to inefficiencies and installation challenges.
Innovation Solution
A modular and compact inverter cooling system design where the rectifier and inversion units are located upstream in the cooling gas flow, allowing simultaneous cooling and achieving equal cooling effects, with the DC link unit downstream, and all units can be arranged on the same mounting surface for convenient bus connection, utilizing parallel cooling fins and shared heat sinks for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If series cooling arrangement is used with flat non-modular design, then all components can be distributed on the same mounting surface, but the cooling air does not flow through all units simultaneously resulting in uneven cooling effects
Solution Approach 1:
The inverter is divided into modular units (rectifier unit, inversion unit, DC link unit) that can be independently arranged. Each module contains its own power semiconductor devices and can be positioned to optimize cooling, allowing parallel cooling paths while maintaining integration on a single mounting surface.
Solution Approach 2:
The patent transitions from a flat two-dimensional series arrangement to a three-dimensional modular configuration. Modules are stacked or arranged in layers with cooling air flowing through multiple levels simultaneously, enabling parallel cooling paths without increasing the horizontal footprint.
2Ease of operation
If series cooling arrangement is used, then installation is simplified, but the volume is large and both installation and disassembly are inconvenient
Solution Approach 1:
The inverter system is segmented into standardized modular units that can be independently manufactured, tested, and installed. This modularity allows for compact stacking arrangements that reduce overall volume while maintaining ease of installation through standardized mounting interfaces and bus connections.
Solution Approach 2:
Multiple functional units (rectifier, inversion, DC link) are merged into integrated modular assemblies that combine power conversion functions with thermal management. This integration reduces the total volume by eliminating separate cooling paths and shared mounting infrastructure.
3Productivity
If parallel cooling arrangement is used with modular design, then simultaneous cooling of multiple units is achieved, but the device complexity increases
Solution Approach 1:
The modular design employs universal mounting interfaces, standardized bus connections, and common cooling infrastructure that can serve multiple units simultaneously. This universality allows parallel cooling paths to be implemented without proportionally increasing system complexity, as the same structural and electrical interfaces are reused across modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures uniform cooling for high-power semiconductor devices, simplifies bus wiring, and facilitates easy installation and expansion, while maintaining a compact system size by optimizing the arrangement of components and airflow.
Implementation Method 1
the rectifier unit and the inversion unit are located upstream in a flow direction of a cooling gas flow
Implementation Method 2
good heat dissipation is needed to ensure operational performance
Data Source
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AI summary
Disclosed in embodiments of the present invention are an inverter module, an inverter and an inverter cooling system. The inverter module comprises: a rectifier unit (11), a DC link unit (12) and an inversion unit (13), wherein the rectifier unit (11) and the inversion unit (13) are located upstream in a flow direction of a cooling gas flow; the DC link unit (12) is disposed downstream in the flow direction of the cooling gas flow. In an embodiment of the present invention, a modular and compact inverter module is proposed, wherein the rectifier unit and inversion unit have the same cooling effect, and connection of a DC bus is very convenient.