Modular Single-Channel I/O Sub-Chassis for Channel Replacement
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Solution Overview
Problem
Existing industrial automation I/O modules are inflexible, as their I/O channels are manufactured with a specific type and cannot be altered or customized, leading to unnecessary module purchases and high replacement costs due to single channel failures, which require entire module replacement and disrupt connected devices.
Innovation Solution
An I/O module with a modular sub-chassis design allowing for the insertion and removal of individual single channel I/O subsystems, enabling customization and easy replacement of specific channels without affecting other functioning channels, with a shared primary backplane interface circuit board and dedicated I/O circuit boards for each channel type.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If individual I/O channels are made replaceable in a modular sub-chassis, then ease of repair and customization improve, but device complexity increases due to multiple separate channel subsystems
Solution Approach 1:
The I/O module is divided into multiple independent single-channel I/O subsystems that can be individually installed, removed, and replaced within a modular sub-chassis. Each subsystem handles a specific I/O channel, allowing selective maintenance and customization without affecting other channels.
Solution Approach 2:
The modular sub-chassis design with standardized interfaces allows the same physical infrastructure to support multiple different I/O channel types. Users can customize the configuration by installing different channel subsystems based on application requirements, making the system universally adaptable to various needs.
2Ease of manufacture
If entire I/O modules must be replaced for single channel failure, then manufacturing simplicity is maintained, but loss of time and productivity decrease due to system shutdown and reconfiguration
Solution Approach 1:
The I/O module is segmented into independent single-channel subsystems within a modular sub-chassis, allowing individual channel replacement without replacing the entire module. This enables hot-swapping of failed channels while other channels continue to operate, eliminating system downtime.
Solution Approach 2:
The failed I/O channel subsystem is extracted and removed from the modular sub-chassis independently, allowing replacement of only the defective component rather than the entire integrated module. This extraction approach minimizes disruption to the overall system.
3Manufacturing precision
If I/O channels are manufactured with fixed types, then manufacturing precision is maintained, but adaptability decreases as channels cannot be customized or altered after manufacturing
Solution Approach 1:
The system transitions from a static, fixed-configuration design to a dynamic, reconfigurable architecture where I/O channel subsystems can be added, removed, or swapped based on changing application requirements. This dynamic approach maintains manufacturing simplicity while enabling post-manufacturing adaptability.
Solution Approach 2:
The system allows changes in the functional parameters of the I/O module by replacing channel subsystems with different specifications. Each subsystem can be optimized for specific I/O types during manufacturing, while the modular arrangement enables parameter changes at the system level through reconfiguration.
Data Source
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Figure 4A
AI summary
An industrial automation input/output (I/O) module includes a body defining an internal space including a plurality of slots. A module backplane connector is connected to the body, and a primary backplane interface circuit board is located in the space of the body. The primary backplane interface circuit board is electrically connected to the module backplane connector and includes electronic devices configured to transmit data and power to and from an associated backplane circuit through the module backplane connector. A plurality of individual I/O circuit boards are installed respectively in the plurality of slots of the body. Each of the I/O circuit boards includes electronic devices configured to provide a single-channel I/O circuit for input or output of data with respect to an associated field device. Each of the I/O circuit boards is electrically connected to the primary backplane interface circuit board when installed in a respective one of said slots, and each of the plurality of I/O circuit boards is selectively removable from its respective slot and from the internal space of the body for selective electrical disconnection of said I/O circuit board from the primary backplane interface circuit board.