Modular I/O Interface Assembly for Motherboard Space Saving

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Solution Overview

Problem

The existing Thunderbolt 3 interface designs require additional space on the motherboard for electrical connectors and driving chips, and the increasing performance requirements of graphics cards make it inconvenient to install them in the PCI-E slot, limiting motherboard expandability.

Innovation Solution

An input/output transmission interface assembly is designed with a first and second circuit board, each equipped with electrical connectors and a driving chip, connected via a board-to-board connector, allowing these components to be removed from the motherboard and mounted on an independent circuit board, which can be plugged into the PCI-E slot, thereby freeing up space and enhancing motherboard flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrical connectors and driving chips are directly welded on the motherboard, then connection reliability is improved, but motherboard space is increased

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmotherboard space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent divides the motherboard into functional modules by separating electrical connectors and driving chips onto independent circuit boards (first and second circuit boards). These modules can be independently assembled and replaced, reducing the space required on the main motherboard while maintaining connection reliability through standardized board-to-board connectors.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional layout where all components are welded directly on the motherboard surface to a three-dimensional modular architecture. Circuit boards are stacked vertically and connected through board-to-board connectors, utilizing the vertical dimension to reduce footprint while maintaining all necessary electrical connections.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Power

If graphics card is installed in the PCI-E slot to meet performance requirements, then graphics performance is improved, but motherboard expandability is reduced

Engineering Contradiction:
Improvegraphics performanceVSAvoidmotherboard expandability
Core Design Contradiction:
PowerVSAdaptability or versatility

Solution Approach 1:

The patent creates a universal interface system where the first and second circuit boards can support multiple types of transmission interfaces (Thunderbolt 3, USB 3.2, Mini DisplayPort, DisplayPort). This modular design allows the same physical slot to accommodate different interface types and configurations, enhancing motherboard versatility without sacrificing graphics performance capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If multiple transmission interfaces are integrated on the motherboard, then interface compatibility is improved, but device complexity is increased

Engineering Contradiction:
Improveinterface compatibilityVSAvoidmotherboard complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments different transmission interface types onto separate circuit boards (first circuit board for Thunderbolt 3/USB 3.2, second circuit board for Mini DisplayPort/DisplayPort). Each board is dedicated to specific interface types, simplifying the design and assembly process while providing comprehensive interface compatibility through modular integration.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11742603B2Input/output transmission interface assembly and motherboard module including thereof
Publication Date: 2023.08.29 MICRO STAR INTERNATIONAL CO LTD
  • US11742603B2 patent drawing
  • US11742603B2 patent drawing
  • US11742603B2 patent drawing

AI summary

An input/output transmission interface assembly capable of being assembled on a motherboard includes a first transmission interface, a board-to-board connector, and a second transmission interface. The first transmission interface includes a first circuit board, a first electrical connector, a driving chip, and a plug portion. The plug portion is at one side of the first circuit board for being plugged into the motherboard. The second transmission interface includes a second circuit board and a second electrical connector. The second circuit board is substantially parallel to the first circuit board. The board-to-board connector is assembled on and between the first circuit board and the second circuit board. The first circuit board and the second circuit board are electrically connected with each other through the board-to-board connector.