Modular IT Enclosure Cooling System with Segmented Connection Module
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Solution Overview
Problem
Data centers face high maintenance and upgrade costs due to integrated cooling systems, where replacing a defective component often requires replacing the entire system, and integrating new, more efficient cooling hardware is challenging.
Innovation Solution
A modular cooling system design featuring a connection module with standard fluid connections and modules like heat exchanger, pump, and bypass modules, allowing for easy replacement and customization, enabling the integration of various cooling configurations and types, such as liquid, immersion, and hybrid systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cooling hardware units are integrated as an inseparable unit, then system reliability is improved, but maintenance cost and device complexity increase
Solution Approach 1:
The cooling system is divided into separate modular units including rack-mounted cooling modules and enclosure-mounted cooling modules. Each module can be independently installed, maintained, and replaced without affecting the entire system, thereby reducing maintenance costs and device complexity while maintaining system reliability through modular redundancy.
2Reliability
If cooling hardware units are integrated as an inseparable unit, then system reliability is improved, but service and maintenance cost increase
Solution Approach 1:
The cooling system is segmented into independent rack-mounted and enclosure-mounted modules that can be serviced separately. When a component fails, only the specific defective module needs to be accessed and repaired, not the entire integrated system, significantly reducing service and maintenance costs while preserving system reliability.
Solution Approach 2:
The cooling function is extracted from the facility loop and implemented as standalone rack-mounted and enclosure-mounted modules. This extraction allows each module to be independently maintained and repaired without disrupting the entire cooling system, reducing maintenance costs while maintaining reliability through localized repairs.
3Stability of the object's composition
If all cooling hardware units are integrated, then system stability is improved, but adaptability to new hardware decreases
Solution Approach 1:
The cooling system is segmented into standardized modular units with defined interfaces. This segmentation allows individual modules to be upgraded or replaced with newer, more efficient hardware while maintaining system stability through consistent modular architecture and standardized connection protocols.
Solution Approach 2:
The rack-mounted and enclosure-mounted cooling modules are designed with universal interfaces and standardized configurations that can accommodate different hardware types and future upgrades. This universality enables the system to adapt to new hardware while maintaining overall system stability through consistent modular design principles.
4Ease of manufacture
If cooling system is designed as integrated unit, then manufacturing simplicity is improved, but ease of manufacture decreases
Solution Approach 1:
The cooling system is manufactured as separate rack-mounted and enclosure-mounted modules that can be produced independently using standardized processes. This segmentation simplifies manufacturing by allowing each module to be assembled and tested separately before final integration, reducing device complexity while improving ease of manufacture through modular production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This modular approach reduces maintenance costs, allows for efficient rack architectures, facilitates flexible service and maintenance, decouples cooling system design from facility loops, and enhances compatibility with different IT configurations, ensuring high reliability and adaptability.
Implementation Method 1
cooling fluid can enter an information technology (IT) enclosure via a fluid inlet port on the IT enclosure, pass through a connection module and a number of cooling modules, and exit the cooling system via a fluid outlet port
Data Source
AI summary
According to various embodiments, described herein are systems and methods for designing and configuring cooling systems for server racks in an IT cluster. In one embodiment, a cooling system can include a connection module with fluid loop connections and standard fluid ports, and a number of cooling modules, such as a heat exchanger module, a pump module, and a first bypass module, and a second bypass module. The connection module can use the standard fluid connections and standard ports to connect the cooling modules together to form a complete multiple function cooling unit. The cooling unit can be attached to an IT enclosure via the fluid ports on the connection module, and fluid loops are connected between the IT enclosure and each individual cooling modules. The connection module can be customized including the cooling ports, fluid loop connections to accommodate assembling of different standard cooling modules and corresponding functions.