Modular Jack Base Element Segmentation for Compact Footprint
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Solution Overview
Problem
Conventional modular jack assemblies occupy excessive space due to the mounting of the main board and power over ethernet assembly at the rear portion, which hinders miniaturization efforts in computer and network appliances.
Innovation Solution
The modular jack assembly features a terminal module with an improved base element design, including a pair of daughter boards, a contacting module, and a connecting element, allowing for separate mounting of the power over ethernet assembly at the rear and the mother board at the bottom, with connecting terminals and L-shaped contacts that reduce the front-to-back footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the main board and power over ethernet assembly are mounted at the rear portion of the base element, then the electrical connections are simplified, but the front-to-back space occupation increases
Solution Approach 1:
The patent divides the mounting locations into two separate regions: the rear portion for the power over ethernet assembly and the bottom portion for the main board. This segmentation allows each component to be positioned optimally, reducing the front-to-back space occupation while maintaining simplified electrical connections through dedicated mounting areas.
Solution Approach 2:
The patent transitions from a single-plane mounting approach to a multi-dimensional arrangement by mounting the main board at the bottom portion and the power over ethernet assembly at the rear portion. This spatial redistribution across different dimensions reduces the front-to-back footprint while preserving electrical connection simplicity.
2Device complexity
If the main board is mounted at the rear portion along with the power over ethernet assembly, then the assembly structure is simplified, but the modular jack assembly size increases
Solution Approach 1:
The patent segments the mounting locations into distinct regions: rear portion for power over ethernet assembly and bottom portion for main board. This segmentation enables compact arrangement that reduces overall assembly volume while maintaining structural simplicity through clear spatial organization.
Solution Approach 2:
By distributing components across different spatial dimensions (rear vs. bottom mounting), the patent achieves a compact three-dimensional arrangement that reduces overall assembly volume compared to conventional two-dimensional rear-mounted configurations.
Data Source
AI summary
A modular jack assembly (1) for being mounted on a mother board (4) and engaging with a mating plug. The modular jack has a number of terminal modules (3), an insulative housing (2), an outer shield (6) surrounding the insulative housing (2) and a power over ethernet assembly (33). The terminal module is provided with a base element (310) having a front portion (3101), a rear portion (3102), a top portion (3103), a side portion (3107) and a number of connecting terminals (35) mounted thereon. The terminal module further includes a pair of daughter boards (311) attached to the side portions of the base element, a contacting module (30) assembled to the front portion and a connecting element (32) mounted to the rear portion.