Modular Jack With Vertical Shielding For High Speed Ethernet
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Solution Overview
Problem
Existing modular jack connectors for high-speed networks lack complete shielding between adjacent ports, which is necessary for effective signal conditioning and electromagnetic compatibility, especially in Ethernet networks.
Innovation Solution
A modular jack connector design featuring vertically stacked ports with alternating vertical PCBs and shield modules, each with a vertical shield plate, providing comprehensive shielding between adjacent ports and ensuring signal conditioning components are integrated for optimal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shielding is added between adjacent ports to improve electromagnetic compatibility and signal conditioning, then electromagnetic compatibility is improved, but device complexity increases
Solution Approach 1:
The connector is divided into multiple modules, each containing a contact module and a shield module. The shield module is further segmented into a shield plate, insulating housing portion, and grounding structure. This segmentation allows the shielding function to be integrated into each port module independently, improving electromagnetic compatibility without significantly increasing overall device complexity through modular design.
Solution Approach 2:
The shield module is merged with the contact module to form an integrated port assembly. The insulating housing portion of the shield module is integrated with the contact module housing, and the shield plate is positioned within the same modular structure. This merging approach ensures complete shielding between adjacent ports while maintaining a compact, unified device structure.
2Productivity
If vertically stacked ports are implemented to increase port density, then productivity is improved, but shielding completeness deteriorates
Solution Approach 1:
The connector utilizes vertical stacking of ports in the vertical dimension while maintaining shielding effectiveness. The shield plate extends vertically between the upper and lower ports, and the insulating housing portion provides lateral shielding. This three-dimensional arrangement achieves high port density without compromising shielding completeness between adjacent stacked ports.
Solution Approach 2:
The shield module acts as an intermediary structure between adjacent vertically stacked ports. The shield plate and insulating housing portion form a barrier that mediates electromagnetic interference between the upper and lower ports, enabling close vertical spacing while maintaining shielding effectiveness.
3Reliability
If signal conditioning components are integrated within the connector to improve signal quality, then reliability is improved, but device complexity increases
Solution Approach 1:
The modular port design with integrated shield and contact modules provides a universal structure that can accommodate various signal conditioning components. The standardized module interface allows different component configurations within the same basic structure, enabling signal conditioning functionality without significantly increasing overall device complexity through reusable modular units.
Data Source
AI summary
A modular jack (100) is adapted to be mounted onto a horizontal mother printed circuit board (PCB). The modular jack comprises a housing (200) defining an upper row of ports and a lower row of ports vertically stacked in columns, a number of vertical PCBs (46, 47) extending along a front-to-rear direction and being aligned laterally, a number of shield modules (500, 54) each having a vertical shield plate (50, 548) and an insulating portion (48 and 49, 55) at least partially encapsulating the vertical shield plate. Each of the vertical PCB electrically connecting with a set of mating contacts extending into one of the upper row of ports and the lower row of ports. The vertical PCBs and the shield modules are stacked side by side in an alternating manner.