Modular Jet Impingement Assembly for Electronics Cooling
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Solution Overview
Problem
Conventional heat sinks are inadequate for managing high heat flux generated by power electronics devices, leading to inadequate heat rejection and elevated operating temperatures.
Innovation Solution
A modular jet impingement assembly with active and passive fluid flow control features, including angled inlet and outlet connection tubes, manifold inserts with impinging and collecting slots, and heat transfer plates with arrays of fins, to facilitate uniform and targeted heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat sinks are used, then device simplicity is maintained, but heat rejection capability is insufficient for high heat flux
Solution Approach 1:
The cooling system is divided into modular manifolds that can be independently configured and assembled. Each manifold contains distributed flow control features (inlet/outlet connection tubes, manifold inserts with impinging and collecting slots) that segment the coolant flow into multiple targeted jets, enabling scalable heat rejection without proportionally increasing overall system complexity
Solution Approach 2:
The system incorporates both passive (fixed geometry inlet/outlet connection tubes) and active (manifold inserts with movable components) flow control mechanisms. These dynamic elements allow real-time adjustment of coolant distribution to match varying heat flux patterns, significantly improving heat rejection capability while maintaining manageable system complexity through controlled adaptability
2Loss of energy
If coolant flow is increased to manage high heat flux, then heat transfer efficiency improves, but flow uniformity deteriorates
Solution Approach 1:
The manifold design incorporates locally-adapted flow control features: inlet connection tubes with specific angles and diameters, manifold inserts with impinging slots positioned at precise locations, and collecting slots strategically placed to redistribute flow. These localized modifications ensure uniform coolant distribution across all impingement zones even at high flow rates, maintaining both heat transfer efficiency and flow uniformity
Solution Approach 2:
Manifold inserts act as intermediary components between the main coolant supply and the impingement slots. These inserts contain collecting slots that gather coolant from multiple inlet connection tubes and redistribute it through impinging slots, serving as a flow-regulating intermediary that ensures uniform distribution while handling high total flow rates
3Adaptability or versatility
If fixed manifold design is used, then manufacturing simplicity is maintained, but adaptability to different cooling requirements is reduced
Solution Approach 1:
The manifold system is segmented into standardized base manifolds and interchangeable manifold inserts. Each insert is designed as a separate, manufacturable component with specific flow control features (inlet/outlet connection tubes, impinging and collecting slots) that can be produced using standard manufacturing processes. This segmentation enables mass production of individual components while allowing flexible assembly configurations to meet different cooling requirements
Solution Approach 2:
The manifold base design incorporates universal mounting features and standardized connection interfaces that can accommodate multiple types of manifold inserts. Each insert provides different flow distribution patterns, allowing a single manifold body to serve multiple cooling applications. This multi-functionality achieves adaptability without requiring custom-manufactured manifolds for each application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular jet impingement assembly effectively manages high heat flux by actively and passively controlling coolant flow, enhancing heat transfer efficiency and extending the operating life of power electronics devices.
Implementation Method 1
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 2
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 3
In one example, fluid may be directed in a jet in a localized region at a high velocity such that the fluid impinges a surface of the heat management device coupled to the heat generating device
Data Source
AI summary
Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.