Modular LED Circuit Assembly Thermal Management
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Solution Overview
Problem
Light-emitting diodes (LEDs) are susceptible to overheating, leading to premature failure, and existing solutions do not adequately address heat dissipation and manufacturing cost efficiency in modular LED circuit assemblies.
Innovation Solution
A modular LED circuit assembly with a thermally conductive substrate and a spring-biased pin configuration that maintains electrical contact across varying axes, allowing for improved heat dissipation and alignment while reducing manufacturing costs through increased tolerance in component alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED mounting methods are used, then manufacturing is simpler, but heat dissipation is inadequate leading to premature failure
Solution Approach 1:
The circuit board is divided into distinct functional areas: a first area for electrical contact and a second area for mechanical support and heat dissipation. This segmentation allows each area to be optimized independently - the first area ensures proper electrical connection while the second area provides robust thermal management through the thermally conductive substrate, thereby extending LED lifespan without requiring complex additional components.
Solution Approach 2:
A spring-biased pin serves as an intermediary element between the circuit board and LED connector. The pin's spring mechanism provides continuous contact pressure, ensuring both reliable electrical connection and stable mechanical attachment. This intermediary component simplifies the overall assembly by consolidating electrical and mechanical functions into a single integrated solution that inherently manages contact reliability.
2Ease of manufacture
If tight alignment tolerances are required for electrical contact, then electrical connection is more reliable, but manufacturing cost increases
Solution Approach 1:
The spring-biased pin introduces a dynamic element to the electrical connection system. Instead of relying on rigid, precision-aligned contacts, the spring mechanism automatically adjusts to accommodate variations in assembly positioning. The spring's elasticity compensates for misalignment within a practical tolerance range, maintaining reliable electrical contact while significantly easing manufacturing requirements and reducing costs.
3Illumination intensity
If LED intensity is increased, then illumination performance improves, but heat generation increases leading to overheating
Solution Approach 1:
The circuit board incorporates a substrate with thermally conductive material specifically in the second area beneath the LED mounting position. This localized thermal management solution directs heat away from the LED junction precisely where it is generated, without requiring the entire circuit board to be thermally conductive. This approach effectively manages heat from high-intensity LEDs while maintaining cost-effectiveness and electrical functionality in other areas of the board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively extends the lifespan of LEDs by enhancing heat dissipation and reducing manufacturing costs through improved thermal conductivity and alignment flexibility, making the modular LED circuit assembly more versatile and cost-effective.
Implementation Method 1
The substrate may include a material with a thermal conductivity greater than about 30 watts per meter-degree Kelvin (30 W/(m*k)). The substrate may be adhered to the LED circuit board with an adhesive including a thermal conductivity greater than about 30 watts per meter-degree Kelvin (30 W/(m*k)).
Data Source
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AI summary
Provided herein is an improved apparatus, method and system for providing a modular LED circuit assembly. Specifically, examples of the present invention include a modular LED circuit which may be scaled and used in a wide variety of form factors. One example of the present invention may provide an apparatus for supporting a light-emitting diode which includes an LED circuit board including a first major surface and a second major surface. The first major surface may include a first contact pad and a second contact pad, where each of the first contact pad and the second contact pad are configured to receive a respective connector from the LED. The second major surface of the LED circuit board may include a first area, a second area, and a third area, where a substrate is attached to the LED circuit board across the third area.