Modular LED Array Interconnection via Clamp Assemblies
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Solution Overview
Problem
High-intensity LED systems face challenges in thermal, optical, and electrical energy management due to high-density packaging requirements, and existing designs lack the ability for quick and easy on-site repair or alteration of LED assemblies to vary radiant energy wavelengths.
Innovation Solution
An LED array with interchangeable LED assemblies, featuring a mounting substrate, power connect clamps, and interconnect clamps that allow for easy replacement and series connection of LED assemblies, using conductive materials to manage electrical connections and withstand high energy environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-density packaging of LED devices is used to achieve high-intensity radiant energy, then the radiant energy output is improved, but the complexity of thermal, optical, and electrical energy management increases
Solution Approach 1:
The LED array is divided into modular LED assemblies that can be independently managed. Each assembly contains its own electrical connections and mounting structure, allowing the complex system to be broken down into manageable units that simplify overall energy management while maintaining high-density packaging for high radiant energy output.
Solution Approach 2:
The mounting substrate and clamp assemblies are designed to perform multiple functions simultaneously: mechanical mounting, electrical connection, and thermal management. This multi-functionality reduces the number of separate components needed, simplifying energy management while supporting high-density LED packaging for high radiant energy output.
2Stability of the object's composition
If fixed LED package designs are used, then manufacturing stability is improved, but the ability to perform quick on-site repair or alteration is worsened
Solution Approach 1:
The LED array is segmented into replaceable modular assemblies that maintain stable manufacturing processes for each unit while enabling easy replacement of individual modules. This allows fixed, stable manufacturing of standardized assemblies while providing flexibility for quick on-site repairs by simply replacing defective modules rather than repairing complex fixed designs.
Solution Approach 2:
The system transitions from a fixed, permanent design to a dynamic, reconfigurable design where LED assemblies can be easily added, removed, or replaced. The standardized mounting and electrical connection interfaces enable this dynamic reconfiguration while maintaining manufacturing stability through consistent, repeatable assembly processes.
3Volume of moving object
If high-density LED array packaging is used, then space efficiency is improved, but the difficulty of electrical interconnection and energy management increases
Solution Approach 1:
The mounting substrate integrates multiple functions into a single component: mechanical support, electrical connection pathways, and thermal management. This merging of functions reduces the complexity of electrical interconnection while maintaining high-density packaging, as the substrate itself provides the interconnection network rather than requiring separate wiring harnesses.
Solution Approach 2:
The clamp assemblies serve as intermediary components that simplify electrical interconnection between LED assemblies. These standardized clamps provide pre-configured electrical connections that mediate between individual LED modules and the power source, reducing the complexity of direct interconnection in high-density arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient electrical interconnection, easy maintenance, and alteration of wavelengths in high-density LED arrays, providing a space-saving and thermally efficient solution for managing high-intensity light energy.
Implementation Method 1
The power connect clamps connect each of a pair of terminal LED assemblies to an electrical power source... The interconnect clamps connect positive and negative electrodes adjacent LED assemblies such that the LED assemblies are interconnected in an electrical series
Implementation Method 2
The power connect clamps may include a power connect fastener threaded into a power connect aperture... Each of the interconnect clamps may have a pair of interconnect fasteners, each of the interconnect fasteners threaded into an interconnect aperture
Data Source
AI summary
An LED array with a plurality of easily replaceable LED assemblies. The LED assemblies are attached to a mounting substrate, e.g., by threaded, electrically insulative fasteners. The LED assemblies are electrically connected in a series by detachable power connect clamps and interconnect clamps. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.