Modular LED Heat-Dissipating Device for Plastic Housing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED lamps require a metal light shell for heat dissipation, leading to increased weight and production costs due to the need for metal materials.
Innovation Solution
A modular LED heat-dissipating device comprising an LED circuit board, a heat-conducting adhesive layer, a heat-dissipating structure with fins, and a wire terminal module, allowing for efficient heat dissipation without the need for a metal lamp housing, enabling ease of assembly, disassembly, and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal light shell is used for heat dissipation in conventional LED lamps, then heat dissipation effectiveness is improved, but weight and production cost increase
Solution Approach 1:
The patent divides the heat dissipation function into separate components: a dedicated heat-dissipating structure with fins attached to the LED board, rather than relying on the light shell itself. This segmentation allows the light shell to be made of lightweight plastic while the heat dissipation function is performed by a separate metal or aluminum structure.
Solution Approach 2:
The heat dissipation function is extracted from the light shell and implemented as a separate heat-dissipating structure. The fins are attached directly to the LED board using a heat-conducting adhesive, separating the heat dissipation function from the housing function, thereby allowing the housing to be made of lighter material.
2Temperature
If a metal light shell is used for heat dissipation in conventional LED lamps, then heat dissipation effectiveness is improved, but production cost increases
Solution Approach 1:
The manufacturing process is segmented into separate components: LED board assembly with integrated heat-dissipating fins, and separate light shell assembly. This allows the light shell to be manufactured from inexpensive plastic materials rather than requiring expensive metal housing, reducing overall production cost while maintaining heat dissipation performance.
Solution Approach 2:
The heat dissipation function is extracted as a separate attachable component, allowing the light shell to be manufactured from cheaper plastic materials. The heat-dissipating structure with fins is produced separately and attached using adhesive, reducing material costs compared to manufacturing an entire metal housing.
3Ease of repair
If a modular LED heat-dissipating device is implemented, then ease of maintenance and assembly is improved, but device complexity increases
Solution Approach 1:
The LED lighting system is segmented into modular components: LED board module with integrated heat-dissipating fins, light shell, and mounting structure. This modular segmentation allows individual components to be easily assembled, disassembled, and replaced during maintenance without affecting the entire system.
Solution Approach 2:
The heat-dissipating structure is extracted as a separate attachable component with fixing apparatus, allowing it to be independently installed and removed. This extraction enables easy maintenance and replacement of the LED board without removing the entire housing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces production costs and weight by eliminating the need for metal in the lamp housing while maintaining effective heat dissipation, promoting widespread use of LED lamps with improved maintenance convenience.
Implementation Method 1
a heat-conducting adhesive layer mounted on a side of the LED circuit board that is opposite to the at least one LED light source
Implementation Method 2
the multiple heat-dissipating fins extend toward the direction away from the heat-conducting adhesive layer
Implementation Method 3
using the multiple heat-dissipating fins of the heat-dissipating structure to dissipate heat from the at least one LED light source
Data Source
AI summary
A modular LED heat-dissipating device includes an LED circuit board, a heat-conducting adhesive layer, a heat-dissipating structure, and a wire terminal module. The LED light source illuminates by power supplied via the wire terminal module. Heat generated from the LED light source is dissipated by the heat-dissipating structure. This device does not dissipate heat by a lamp housing. So the lamp housing can be made of, but not limited to, plastic, thereby decreasing a production cost of the LED lamp. In addition, the modular LED heat-dissipating device can fit various kinds of lamp housings. When the LED light source breaks down, the modular LED heat-dissipating device and the lamp housing can be easily separated to replace or repair the LED light source.