Modular LED Lamp Heat Sink with Removable Electrical Interconnector

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Solution Overview

Problem

Existing LED lamps have permanently secured printed circuit boards (PCBs) to heat sinks, making them difficult to repair, modify, or recycle, as the PCBs cannot be removed without damaging the connection leads, limiting design flexibility and recyclability.

Innovation Solution

A modular LED lamp design where the light module, electronics module, and heat sink are independently detachable, allowing for easy replacement and recycling, with a heat sink that includes structures for efficient heat transfer and a removable electrical interconnector for various LED and PCB configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the PCB is permanently secured to the heat sink, then heat transfer efficiency is improved, but ease of repair and recyclability deteriorate

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidease of repair
Core Design Contradiction:
TemperatureVSEase of repair

Solution Approach 1:

The invention divides the LED lamp into separate modular components: the PCB assembly with LEDs is detached from the heat sink, and the electronics module is separated from the optical module. This segmentation allows each component to be independently replaced or repaired without damaging connection leads, while maintaining effective heat transfer through dedicated thermal interfaces.

Inventive Principle:
Principle #1Segmentation

2Stability of the object's composition

If the PCB is permanently secured to the heat sink, then structural stability is improved, but adaptability deteriorates

Engineering Contradiction:
Improvestructural stabilityVSAvoidadaptability
Core Design Contradiction:
Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The invention transitions from a static, permanent assembly to a dynamic, reconfigurable system. The modular design with standardized interfaces (electrical connectors, mechanical mounting features) enables the system to adapt to different LED configurations, PCB layouts, and heat sink designs while maintaining structural stability during operation through secure but removable connections.

Inventive Principle:
Principle #15Dynamics

3Device complexity

If LEDs are mounted permanently directly to the heat sink, then device complexity is reduced, but ease of manufacture deteriorates

Engineering Contradiction:
Improvedevice complexityVSAvoidease of manufacture
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The invention segments the manufacturing process into independent modules: LED mounting on PCB, PCB assembly with electronics, heat sink fabrication, and final integration. This allows each module to be manufactured separately using optimized processes for that specific component, then assembled using standardized interfaces, improving overall ease of manufacture despite increased modular complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy repair, modification, and recycling of LED lamps, increases design flexibility by allowing different module combinations, and improves compatibility with various LED types, enhancing the lamp's functionality and sustainability.

Implementation Method 1

it was believed to be necessary in order to ensure sufficient heat transfer from the PCB to the heat sink

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS8419225B2Modular light emitting diode (LED) lamp
Publication Date: 2013.04.16 LEDVANCE LLC
  • US8419225B2 patent drawing
  • US8419225B2 patent drawing
  • US8419225B2 patent drawing

AI summary

An LED lamp (10) includes a heat sink (12), an electrical interconnector (18), an electronics module (16), and a light module (14). The electrical interconnector (18) is disposed in a passageway (32) extending between first and second regions (24, 26) of the heat sink (12) and includes contacts (66) exposed within the first and second regions (24, 26). The electronics module (16) is adapted to be selectively attached within the first region (24) and includes a first electrical connector (64). The light module (14) is adapted to be selectively attached within the second region (26) and includes at least one light emitting diode (LED) (34) and a second electrical connector (38). The first and second electrical connectors (64, 38) are adapted to selectively form an electrical connections to the contacts (66) to provide power from a power source to the LED (34) of the lighting module (14).