Modular Lighting Heat Dissipation Module Design
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Solution Overview
Problem
Conventional lamp bulbs face challenges in assembly efficiency due to small-sized components requiring screws or glue, leading to time-consuming assembly and reduced reliability, and high heat generation causing glue deformation, as well as increased costs and weight from using fins for heat dissipation.
Innovation Solution
A modular lighting device with a heat dissipation module featuring a smooth lamp cup and engaging structures for easy assembly, replacing fins with a ring-shaped heat dissipation structure and thermal conductive adhesive for efficient heat transfer, and using a transparent lamp cover for direct coupling with the lamp body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws or glue are used to fasten components, then the components can be assembled together, but the assembling process becomes time-consuming and throughput is low
Solution Approach 1:
The lamp body is divided into modular components (lamp cup, middle sleeve, lamp holder) that can be independently assembled and then quickly integrated. This segmentation allows for simplified assembly procedures while maintaining structural integrity, resolving the contradiction between reliable assembly and production throughput.
Solution Approach 2:
Multiple fastening functions are merged into an integrated coupling structure between the lamp cup and middle sleeve. The engaging structures combine mechanical retention and positioning functions, eliminating the need for separate screws or glue applications and thereby increasing assembly speed without compromising reliability.
2Reliability
If glue is used to bond components, then the components can be bonded together, but the glue deforms or melts under high temperature, reducing reliability
Solution Approach 1:
The chemical bonding mechanism of glue is replaced with a mechanical engagement system featuring protruding engaging structures on the lamp cup that fit into corresponding recesses on the middle sleeve. This mechanical interlocking provides temperature-resistant bonding that maintains reliability under high-temperature operating conditions.
3Temperature
If fins are used for heat dissipation, then heat dissipation efficiency is improved, but the fabricating cost and overall weight increase
Solution Approach 1:
The heat dissipation approach transitions from adding physical fins (increasing surface area through structural modification) to optimizing thermal conduction through material parameter selection. The middle sleeve and lamp cup are designed with thermal conductive properties that efficiently transfer heat without requiring additional fin structures, thereby reducing manufacturing complexity and cost.
Solution Approach 2:
The fin structure is extracted from the design, replacing it with an integrated heat dissipation solution where the middle sleeve and lamp cup themselves serve as heat dissipation pathways. This eliminates the need for separate fin components, reducing both fabricating cost and assembly complexity while maintaining heat dissipation effectiveness.
4Temperature
If fins are used for heat dissipation, then heat dissipation efficiency is improved, but the overall weight of the lamp bulb increases
Solution Approach 1:
The heat dissipation function is merged into the existing structural components (middle sleeve and lamp cup) rather than being added as separate fin structures. This integration eliminates redundant materials and reduces overall weight while maintaining effective heat dissipation through optimized thermal pathways within the existing component geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the assembly process, enhances product reliability, reduces manufacturing costs, and improves heat dissipation efficiency without the need for costly fins.
Implementation Method 1
The at least one heat dissipation block is contacted with the electronic component. The heat dissipation block is penetrated through a sidewall of the middle sleeve... The ring-shaped heat dissipation structure is contacted with the exposed part of the heat dissipation block
Implementation Method 2
The ring-shaped heat dissipation structure is contacted with the exposed part of the heat dissipation block, sheathed around the sidewall of the middle sleeve and disposed within the receiving chamber
Implementation Method 3
The ring-shaped heat dissipation structure... disposed within the receiving chamber
Data Source
AI summary
A heat dissipation module and a modular lighting device with the heat dissipation module are provided. The modular lighting device includes a transparent lamp cover and a lamp body. The transparent lamp cover and the lamp body are combined together easily. The heat dissipation module is disposed within a smooth cup-shaped receiving chamber. A circuit board is accommodated within the receiving chamber. An electronic component on the circuit board is contacted with the heat dissipation module. The arrangement of the heat dissipation module can increase the heat dissipating efficiency of the modular lighting device. In comparison with the conventional fin-type lamp cup, the fabricating cost of the lamp cup of the modular lighting device of the present invention is reduced.