Modular Link Chamber Layout for Vacuum Substrate Transfer
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Solution Overview
Problem
Substrates are exposed to undesirable environments and contaminants during transport between processing locations in semiconductor manufacturing, leading to potential oxidation and contamination.
Innovation Solution
A link chamber for multi-chamber processing tools is introduced, featuring a modular design with facets and chamber openings for substrate transfer, coupled with load lock chambers, process chambers, and a transfer robot, maintaining vacuum conditions and minimizing exposure to contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transported using sealed pods or cassettes between processing locations, then substrate transport between processing systems is enabled, but substrates are exposed to room air and contaminants causing oxidation and contamination
Solution Approach 1:
A link chamber serves as an intermediary vacuum environment between the factory interface and process chambers. The link chamber maintains vacuum conditions while substrates are transferred, eliminating direct exposure to room air. The chamber acts as a mediator that connects the vacuum processing environment with the external loading environment without allowing contamination.
Solution Approach 2:
The link chamber provides an inert vacuum environment for substrate transport. By maintaining vacuum conditions in the link chamber, substrates are protected from oxidizing species and contaminants present in room air during the transfer process from the factory interface to the process chambers.
2Productivity
If multiple processing chambers are integrated in a single tool, then processing efficiency is improved, but device complexity increases
Solution Approach 1:
The processing tool is segmented into distinct functional modules: a factory interface for substrate loading, a link chamber for vacuum transfer, and multiple process chambers for different processing steps. This modular segmentation allows each component to be optimized independently while working together as an integrated system, managing complexity through functional separation.
Solution Approach 2:
The link chamber serves multiple functions: it acts as a vacuum barrier, a transfer chamber, and a connection point for multiple process chambers. By designing the link chamber with multiple facets that can each connect to different process chambers, the system achieves multi-functionality without requiring separate dedicated transfer paths for each chamber.
3Adaptability or versatility
If substrates are transferred through multiple processing locations, then comprehensive substrate processing is achieved, but exposure time to undesirable environments increases
Solution Approach 1:
The link chamber enables continuous substrate transfer under vacuum conditions between the factory interface and multiple process chambers. By maintaining vacuum throughout the transfer path and allowing sequential access to multiple process chambers, the system ensures continuous processing without breaking the vacuum seal, minimizing exposure time to contaminants.
Data Source
AI summary
Embodiments of link chamber for use in multi-chamber processing tools or systems are provided herein. In some embodiments, a link chamber for use in a multi-chamber processing tool includes: a link chamber body having a plurality of facets extending between a bottom plate and a top plate, wherein at least seven of the plurality of facets have a chamber opening to form a plurality of chamber openings, wherein the plurality of chamber openings are sized to pass a substrate therethrough, and wherein each of the plurality of chamber openings are configured to be coupled to a slit valve, a load lock chamber, a cover plate, a process chamber, or a second link chamber body.