Modular Liquid-Cooled Heat Sink for Compact Thermal Management
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Solution Overview
Problem
Traditional liquid-cooled heat sinks for electronic devices are bulky, complex, and prone to leakage, with inefficient heat dissipation due to increased components and size, which can lead to device malfunction from inadequate heat expulsion.
Innovation Solution
A modular liquid-cooled heat sink design integrating a heat absorption module, a liquid transport module, and a heat exchange module, featuring a pump unit, liquid storage chamber, and a fin assembly with connection passages and fan units to form a compact, simplified structure for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional liquid-cooled heat sinks use more components to improve heat dissipation, then heat dissipation ability is improved, but device size increases and structure becomes complex
Solution Approach 1:
The patent integrates the pump unit, liquid storage chamber, fin assembly, and connection passages into a single integrated heat sink structure. The pump unit is disposed within the heat sink body, the liquid storage chamber is formed within the heat sink, and the fin assembly is integrated with the heat sink, eliminating the need for separate external components and reducing overall device size while maintaining effective heat dissipation functionality
Solution Approach 2:
The heat sink structure performs multiple functions simultaneously: the fin assembly provides heat dissipation surface, the pump unit circulates liquid, the liquid storage chamber stores coolant, and the integrated structure itself serves as the mounting platform for all components. This multi-functionality reduces the number of separate components needed, thereby reducing device size and complexity
2Reliability
If traditional liquid-cooled heat sinks include more components to enhance cooling, then heat exchange capability is improved, but assembly time increases
Solution Approach 1:
By combining the pump unit, liquid storage chamber, fin assembly, and connection passages into a pre-integrated heat sink module, the patent reduces the number of separate assembly steps. The integrated structure allows for simplified installation as a single unit rather than assembling multiple separate components, thereby reducing assembly time while maintaining heat exchange capability
3Reliability
If air-cooled heat sinks use more fins to improve heat expulsion, then heat dissipation is improved, but the system becomes inadequate for high heat generation
Solution Approach 1:
The patent employs a liquid cooling system with a pump unit that circulates liquid through connection passages to the fin assembly. This hydraulic approach provides superior heat transfer capability compared to air cooling, enabling the system to effectively dissipate high heat generation from multiple CPU and chip components while maintaining compact proportions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design minimizes size, simplifies assembly, reduces leakage risks, and improves heat dissipation performance by creating a closed circulation system that effectively transfers heat from the CPU and chips to the fins for expulsion, maintaining optimal electronic device temperature.
Implementation Method 1
the circulated liquid provides low heat dissipating ability
Implementation Method 2
a fin assembly (31), at least one connection passage (32) extending through the fin assembly
Implementation Method 3
Some liquid-cooled heat sinks are disclosed by US patents, like U.S. Pat. Nos. 7,971,632, 8,245,764, 8,274,787 and 8,356,505. In general, the liquid-cooled heat sink provides higher effective heat dissipation ability
Data Source
AI summary
A liquid-cooled heat sink includes a heat absorption module having a liquid storage container with one heat conductive side, a liquid inlet and a liquid; a liquid transport module including one inlet tube having a first end connected spatially with the liquid inlet of the storage container and a second end connected spatially with a pump unit, and an outlet tube having a first end connected spatially with the liquid outlet of the storage container and a second end connected spatially with a storage chamber; and a heat exchange module including a fin assembly, one connection passage extending through the fin assembly and one fan unit disposed on the fin assembly, which has two opposite ends respectively connected to the pump unit and the storage chamber, the connection passage having two opposite ends respectively connected to the pump unit and the liquid storage chamber.