Modular Liquid Cooling Assembly for Mixed Component Heat Loads
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Solution Overview
Problem
Existing liquid cooling solutions for electronic components, particularly in data centers, require multiple models of liquid cooling blocks to accommodate different sizes and heat densities of components, leading to increased costs and inefficiencies.
Innovation Solution
A method and system for assembling a family of liquid cooling assemblies using a common model of liquid cooling blocks, where heat spreading bases with varying numbers and sizes of pockets are used to accommodate different electronic components, allowing for efficient cooling with a single model of liquid cooling block.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple models of liquid cooling blocks are produced to accommodate different-sized heat-generating electronic components, then the adaptability to different components is improved, but the manufacturing complexity and production costs increase
Solution Approach 1:
The patent implements a universal liquid cooling block design that can accommodate multiple heat-generating electronic components of different sizes through a standardized interface system. The cooling block maintains consistent dimensions and thermal contact surface area while using adjustable or modular mounting mechanisms to adapt to various component footprints, eliminating the need for multiple cooling block models and simplifying the manufacturing process.
Solution Approach 2:
The mounting system is segmented into modular components that can be configured for different component sizes. Rather than creating different cooling blocks, the patent segments the mounting interface into adjustable elements that can be adapted to various component dimensions while using the same cooling block body.
2Adaptability or versatility
If multiple models of liquid cooling blocks are produced to accommodate different-sized heat-generating electronic components, then the adaptability to different components is improved, but the production costs increase
Solution Approach 1:
The patent implements a universal liquid cooling block design that can accommodate multiple heat-generating electronic components of different sizes through a standardized interface system. The cooling block maintains consistent dimensions and thermal contact surface area while using adjustable or modular mounting mechanisms to adapt to various component footprints, eliminating the need for multiple cooling block models and simplifying the manufacturing process.
3Reliability
If liquid cooling blocks are designed with larger thermal contact surfaces to cool power-dense CPUs, then the heat absorption efficiency is improved, but the device size and complexity increase
Solution Approach 1:
The patent applies local quality by concentrating thermal contact surface area precisely where needed on the heat-generating component. Rather than uniformly increasing the size of the cooling block, the design optimizes the thermal interface to maximize contact with high-heat-density areas, achieving improved heat absorption without proportionally increasing overall device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and complexity by using a single model of liquid cooling block for multiple applications, while maintaining efficient heat transfer and cooling performance across different electronic components.
Implementation Method 1
the block thermal contact surface of each of the liquid cooling blocks having a same surface area... the block thermal contact surface of each of the selected at least one liquid cooling block being in contact with an upper base surface
Implementation Method 2
each of the liquid cooling blocks defining an internal fluid conduit for circulation of cooling fluid therethrough... water (or other liquid) is made to flow through a conduit in the liquid cooling block to absorb heat
Implementation Method 3
providing a first heat spreading base having a first thermal contact surface on a lower side of the first heat spreading base, the first thermal contact surface being configured to be in thermal contact with a first heat-generating electronic component
Data Source
AI summary
A method for assembling a liquid cooling assembly includes: providing liquid cooling blocks each defining an internal fluid conduit; providing a first heat spreading base defining at least one first pocket; and providing a second heat spreading base defining second pockets, a number of second pockets being greater than a number of the at least one first pocket. When assembling a first liquid cooling assembly: at least one liquid cooling block is selected to mate with the first heat spreading base; and the selected at least one liquid cooling block is inserted at least partly into a corresponding one of the at least one first pocket. When assembling a second liquid cooling assembly: at least two liquid cooling blocks are selected to mate with the second heat spreading base; and the selected at least two liquid cooling blocks are inserted at least partly into corresponding ones of the second pockets.