Modular Liquid Cooling System for Electronic Components
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Solution Overview
Problem
Traditional cooling systems for high-speed electronic components become cumbersome and inefficient, failing to effectively remove heat from advanced components, especially in newer systems where forced-air cooling is insufficient.
Innovation Solution
A modular cooling system that integrates heat exchangers into preconfigured slots within computer chassis, using either air-cooled or liquid-cooled heat exchangers connected through a cooling loop to heat sinks, allowing for flexible configuration and retrofitting without specialized mounting, and utilizing phase change refrigeration for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional forced-air cooling systems are used, then the cooling mechanism remains simple, but the heat removal capability is insufficient for advanced electronic components
Solution Approach 1:
The patent transitions from forced-air cooling to liquid cooling systems, utilizing hydraulic principles to transport coolant through closed-loop circuits. Liquid cooling provides superior heat removal capability through higher thermal conductivity and heat capacity of liquid media compared to air, enabling effective cooling of high-power electronic components while maintaining manageable system complexity through standardized cooling plates and fluid circulation channels.
Solution Approach 2:
The patent employs phase change refrigeration technology where refrigerant undergoes phase transitions (liquid to vapor and back) to absorb and release heat. This phase change mechanism enables highly efficient heat transfer with constant temperature operation, significantly improving heat removal capability for advanced electronic components while the compact nature of phase change systems keeps the overall device size manageable.
2Reliability
If more effective cooling schemes are implemented, then heat removal efficiency improves, but the mechanisms become larger and more difficult to install
Solution Approach 1:
The patent integrates cooling components directly into the electronic component housing and circuit board structure. Cooling plates are embedded within the component packages, and cooling channels are routed through existing structural elements. This nested integration allows effective cooling mechanisms to be accommodated within the original footprint without requiring additional external space, thereby maintaining compact system size while achieving high cooling effectiveness.
Solution Approach 2:
The patent designs cooling systems that serve multiple functions: structural support, electrical insulation, and heat dissipation. Cooling plates simultaneously provide mechanical mounting surfaces and thermal conduction paths. Housing structures serve both protective and cooling channel functions. This multi-functionality reduces the need for separate dedicated cooling components, thereby reducing overall system volume while maintaining reliable cooling performance.
3Productivity
If traditional cooling systems are used, then installation is straightforward, but they cannot accommodate higher operating speeds and computing power
Solution Approach 1:
The patent incorporates cooling infrastructure during the initial design and manufacturing stages of electronic components. Cooling channels are pre-routed through circuit boards, cooling plates are pre-installed in housing, and thermal interface materials are pre-applied to heat generation surfaces. This preliminary preparation ensures that high-power operating modes can be immediately supported when needed, enabling higher operating speeds and computing power without requiring retrofits or additional complexity during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat removal from electronic components, allowing for higher operating speeds and computing power while minimizing space and complexity, and can be easily integrated into existing systems without the need for extensive reconfiguration or additional mounting hardware.
Implementation Method 1
utilizing phase change refrigeration for efficient heat dissipation
Implementation Method 2
The working fluid absorbs heat from the electronic component
Implementation Method 3
The heat exchanger cools the working fluid
Data Source
AI summary
A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.