Modular Liquid Cooling Layout for High-Density Data Center Heat Dissipation
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Solution Overview
Problem
Traditional air-cooling methods are inadequate for high-power density electronic devices in data centers, leading to inefficiencies in heat dissipation, energy, and space utilization.
Innovation Solution
A liquid-cooled data center system with integrated cold source devices and cooling apparatuses, utilizing multiple heat exchange modules and controlled valve assemblies to manage cooling working medium flow, enabling modular expansion and adaptive cooling based on ambient conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional air-cooling methods are used, then the system is simple to implement, but heat dissipation efficiency is insufficient for high-power density electronic devices
Solution Approach 1:
The patent applies liquid cooling technology by introducing a cooling liquid circulation system that directly contacts electronic devices through cooling plates or immersion tanks. The cooling liquid absorbs heat from high-power density devices and transports it to heat exchangers, achieving superior heat dissipation efficiency compared to air cooling while managing the increased system complexity through standardized modular designs.
Solution Approach 2:
The patent introduces a cooling liquid as an intermediary substance between the heat source (electronic devices) and the heat sink (environment). The cooling liquid acts as a mobile heat carrier, absorbing thermal energy from devices and transporting it to heat exchangers where heat is transferred to air or water, thereby resolving the heat dissipation bottleneck of direct air cooling.
2Loss of energy
If liquid-cooling systems are implemented, then heat dissipation efficiency improves, but space utilization and energy consumption are affected
Solution Approach 1:
The patent employs phase change cooling technology where the cooling liquid undergoes phase transitions (evaporation and condensation) to absorb and release large amounts of latent heat. This parameter change approach enables highly efficient heat dissipation with reduced circulation pump energy consumption, as the phase change process itself provides powerful cooling without requiring continuous high-energy mechanical compression.
Solution Approach 2:
The cooling liquid circulation system serves multiple functions simultaneously: it cools high-power density electronic devices, transports heat to heat exchangers, and can be integrated with existing air conditioning systems. This multi-functionality reduces the need for separate cooling infrastructure, thereby lowering overall energy consumption despite the added complexity of the liquid cooling loop.
3Loss of energy
If liquid-cooling systems are implemented, then heat dissipation efficiency improves, but the system structure becomes more complex
Solution Approach 1:
The patent divides the liquid cooling system into modular segments including independent cooling plates for different device types, separate circulation loops for different thermal zones, and distributed heat exchangers. This segmentation allows each module to be optimized independently and facilitates maintenance and scalability, managing overall system complexity through standardized modular components.
Solution Approach 2:
The patent integrates the liquid cooling system within existing data center infrastructure by nesting cooling plates inside device enclosures, embedding heat exchangers in wall structures, and incorporating piping within floor or ceiling voids. This nesting approach minimizes the visible footprint and integrates cooling components into existing spatial frameworks, reducing the perceived structural complexity.
4Adaptability or versatility
If modular liquid-cooling devices are used, then scalability improves, but integration and deployment become more challenging
Solution Approach 1:
The patent designs cooling systems as standardized modular units with predefined thermal capacities and connection interfaces. Each module can be independently manufactured, tested, and deployed, allowing data centers to scale cooling capacity by simply adding or removing modules. The segmentation into standardized units simplifies the integration process despite the modular complexity.
Solution Approach 2:
The modular cooling devices are designed with universal interfaces and standardized connection protocols that work across different device types and configurations. This universality enables a single module design to serve multiple cooling scenarios, reducing the variety of integration challenges and simplifying deployment procedures despite the modular architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency, enhances energy and space utilization, and supports modular scalability and reliability of computing devices.
Implementation Method 1
the liquid-cooled device includes at least one cooling apparatus for cooling a server module as loaded
Implementation Method 2
a connecting pipeline connected between the liquid-cooled device and the cold source device to form a cooling circulation pipeline
Implementation Method 3
the cold source device is used for exchanging heat with a cooling working medium in the at least one cooling apparatus
Data Source
AI summary
A liquid-cooled data center is disclosed, comprising: a liquid-cooled device; and a cold source device, which is connected to the liquid-cooled device and is used for cooling the liquid-cooled device. By means of the technique of the present application, cooling requirements of a plurality of computing devices at a data center are met, so as to facilitate an improvement in the circulation efficiency of a cooling working medium circularly flowing between a liquid-cooled device and a cold source device, thereby improving the cooling efficiency.