Modular Liquid Cooling Unit for Peripheral Devices
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Solution Overview
Problem
The increasing demand for heat dissipation in heterogeneous computing environments, driven by the offloading of tasks from main CPUs to peripheral components, poses challenges in thermal management, particularly in server systems with diverse workload and configurations, where existing cooling solutions lack interoperability with different server designs and peripheral PCB configurations.
Innovation Solution
A modular liquid cooling unit with movable mounting structures and liquid distribution channels that can accommodate various liquid loop arrangements, allowing for reconfigurable server chassis designs to support multiple peripheral devices and heterogeneous processors, enabling efficient heat distribution and management across different server system configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is implemented to handle increased heat dissipation from peripheral devices, then thermal management capability is improved, but device complexity increases due to the need for interoperable mounting structures and liquid distribution channels
Solution Approach 1:
The mounting structures are designed with universal interfaces that can accommodate different peripheral device configurations and server system designs. The liquid distribution channels are configured to work with various liquid loop arrangements, enabling a single cooling unit to serve multiple applications without requiring custom designs for each configuration.
Solution Approach 2:
The cooling system is divided into modular components including separate mounting structures and liquid distribution channels. This segmentation allows each component to be independently designed and optimized while maintaining interoperability, reducing overall system complexity compared to a monolithic approach.
2Adaptability or versatility
If the cooling unit is designed to accommodate various server configurations and peripheral PCB layouts, then adaptability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The mounting structures incorporate standardized interfaces and tolerance compensation mechanisms that enable them to work with different peripheral device configurations. This universality allows the same mounting structure to accommodate various server configurations without requiring extremely tight manufacturing tolerances for each specific application.
Solution Approach 2:
The design allows for parameter variations in mounting positions and liquid distribution channel configurations while maintaining functional performance. This flexibility in acceptable parameters reduces the stringency of manufacturing precision requirements while still achieving the desired adaptability across different configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular cooling solution effectively addresses the thermal management challenges by providing a flexible and interoperable cooling system that can distribute cooling liquid to peripheral devices, accommodating various server configurations and increasing processing power, thereby enhancing heat dissipation efficiency and system reliability.
Implementation Method 1
a liquid cooling plate (107P) coupled to the one or more liquid distribution channels to receive cooling liquid to cool the one or more peripheral devices (109P) and to return warm liquid to the one or more liquid distribution channels
Data Source
AI summary
A cooling unit to deliver liquid cooling to one or more peripheral devices is disclosed. The cooling unit includes one or more first mounting structures, the one or more first mounting structures are mounted onto the cooling unit, where the one or more first mounting structures are movable along a first direction. The cooling unit includes one or more cooling devices mounted to the one or more first mounting structures, where each of the one or more cooling devices is coupled to the one or more liquid distribution channels to receive cooling liquid to cool one or more peripheral devices of a server system. The cooling unit includes one or more liquid distribution channels to distribute cooling liquid within the server system, between the server system and other server systems, and/or between the server system and a liquid distribution system of an electronic rack.