Modular Liquid Submersion Cooling System for Scalable Electronics
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Solution Overview
Problem
Existing liquid submersion cooling systems for electronics lack scalability and portability, making it difficult to adapt to changing cooling needs and deploy in various environments.
Innovation Solution
A modular liquid submersion cooling system comprising interchangeable electronics enclosures, manifolds, pumps, and heat exchanger units, allowing for scalable and portable cooling solutions with quick connect fluid couplings and adjustable heat exchange capacities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid submersion cooling systems are designed for fixed capacity, then cooling effectiveness is maintained, but scalability and adaptability to changing needs deteriorate
Solution Approach 1:
The cooling system is divided into modular components (electronics enclosures, manifolds, pumps, heat exchanger units) that can be independently configured and scaled. Each module can be added or removed to match changing cooling requirements while maintaining system effectiveness.
Solution Approach 2:
The system employs adjustable and reconfigurable components including variable speed pumps, adjustable heat exchanger configurations, and flexible manifold arrangements that allow the cooling capacity to dynamically adapt to varying thermal loads and operational requirements.
2Stability of the object's composition
If traditional fixed cooling systems are used, then stable operation is achieved, but portability and ease of deployment deteriorate
Solution Approach 1:
By segmenting the cooling system into standardized modular units with uniform connection interfaces, the system becomes easily transportable and rapidly deployable while maintaining operational stability through consistent module configurations and proven design patterns.
3Ease of operation
If modular components with quick connect couplings are used, then ease of deployment improves, but system complexity increases
Solution Approach 1:
The quick connect couplings and standardized interfaces serve multiple functions: enabling rapid assembly/disassembly, ensuring liquid-tight seals, providing mechanical alignment, and facilitating electrical connections. This multi-functionality reduces the number of separate components needed, thereby managing system complexity despite the enhanced ease of deployment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible scaling and easy deployment of cooling systems to accommodate different electronic loads and environments, improving energy efficiency and reducing operational noise and contamination risks.
Implementation Method 1
cooling the electronics through direct contact with a liquid coolant
Implementation Method 2
The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs
Implementation Method 3
a manifold, pump and at least one heat exchanger unit with which the at least one electronics enclosure is designed to best operate with
Data Source
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AI summary
A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.