Modular Litho Tool Clusters for Photoresist Handling
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Solution Overview
Problem
Current lithographic tool clusters experience throughput losses due to time delays required for cleaning and processing changes when handling multiple semiconductor workpieces with different photoresist chemicals, leading to inefficiencies in semiconductor processing.
Innovation Solution
A modular lithographic tool arrangement with clustered tools and a transfer assembly that allows for selective and independent control of baking, coating, exposure, and development units, enabling parallel processing and efficient transfer between clusters to minimize delays and optimize throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single lithographic tool cluster processes multiple semiconductor workpieces with different photoresist chemicals, then versatility is improved, but time delays increase due to cleaning and processing changes
Solution Approach 1:
The patent divides the lithographic processing system into multiple independent tool clusters, where each cluster is dedicated to processing semiconductor workpieces with a specific photoresist chemical type. This segmentation eliminates the need for cleaning and processing changes when switching between different photoresist chemicals, as each cluster operates independently with its designated chemical type, thereby resolving the time delay issue while maintaining overall system versatility.
Solution Approach 2:
The patent creates a multi-functional system by deploying multiple specialized tool clusters that collectively handle all photoresist chemical types. While each individual cluster is specialized for one chemical type, the overall system achieves universality by being able to process any workpiece type through appropriate cluster selection, thus maintaining versatility without the downsides of shared resource conflicts.
2Productivity
If lithographic tools are arranged in a traditional sequential layout, then device complexity is reduced, but productivity decreases due to sequential processing requirements
Solution Approach 1:
The patent transitions from a one-dimensional sequential processing layout to a multi-dimensional parallel architecture by arranging multiple tool clusters in spatial configuration that enables simultaneous processing. Workpieces can be routed to different clusters based on their photoresist chemical requirements, allowing parallel processing operations to occur concurrently, thereby dramatically improving throughput despite the increased structural complexity.
Data Source
AI summary
The present disclosure relates to a lithographic tool arrangement for semiconductor workpiece processing. The lithographic tool arrangement groups lithographic tools into clusters, and selectively transfers a semiconductor workpiece between a plurality of lithographic tools of a first type in a first cluster to a plurality of lithographic tools of a second type in a second cluster. The selective transfer is achieved though a transfer assembly, which is coupled to a defect scan tool that identifies defects generated in the lithographic tool of the first type. The disclosed lithographic tool arrangement also utilizes shared structural elements such as a housing assembly, and shared functional elements such as gases and chemicals. The lithographic tool arrangement may consist of baking, coating, exposure, and development units configured to provide a modularization of these various components in order to optimize throughput and efficiency for a given lithographic fabrication process.