Modular LLCR Testing Apparatus for Processor Sockets
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Solution Overview
Problem
Existing LLCR measurement devices are bulky, inconvenient to use, prone to wire connection issues leading to erroneous measurements, and unable to accommodate large thermal management solutions without altering them, which limits their effectiveness in testing processor socket designs.
Innovation Solution
A modular LLCR testing apparatus comprising a test board, interface board, and patch board that are releasably connectable, allowing for flexible orientation and accommodating large thermal management solutions, reducing the risk of wire connection errors, and enabling portability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If existing LLCR measurement devices are used, then measurement capability is provided, but the devices are bulky and inconvenient to use
Solution Approach 1:
The testing apparatus is divided into separate modular components including a socket board, processor board, and thermal management solution board that can be independently handled and assembled. This segmentation allows each component to be compact while maintaining full measurement capability when assembled together.
Solution Approach 2:
The patent transitions from a monolithic three-dimensional bulky device to a flat, two-dimensional board-based architecture. The socket board, processor board, and thermal management solution are arranged in layers that can be stacked or assembled in a compact footprint, dramatically reducing the overall volume while preserving measurement functionality.
2Measurement precision
If existing LLCR measurement devices are used, then measurement capability is provided, but wire connection issues cause erroneous measurements
Solution Approach 1:
The patent extracts and eliminates the wire connections from the measurement system by implementing direct board-to-board electrical contacts. The socket board and processor board are electrically connected through rigid traces and contact pads rather than flexible wires, removing the source of connection errors and improving both precision and reliability.
Solution Approach 2:
The electrical connection function is merged into the structural assembly of the boards themselves. The mechanical assembly of the socket board, processor board, and thermal management solution inherently creates the electrical pathways through integrated traces and contact points, eliminating the need for separate wire connections and reducing measurement errors.
3Adaptability or versatility
If existing LLCR measurement devices are used, then measurement capability is provided, but they cannot accommodate large thermal management solutions without alteration
Solution Approach 1:
The socket board is designed with a universal interface that can accommodate various processor types and thermal management solution sizes. The board layout and electrical connections are configured to support different configurations without requiring modification of the measurement apparatus itself, enhancing adaptability while preventing physical alterations to the thermal management solutions.
Solution Approach 2:
The patent implements a dynamic and flexible board configuration that can adapt to different thermal management solution sizes. The processor board and its associated components are arranged to provide adjustable spacing and orientation, allowing the system to accommodate large thermal management solutions without requiring physical alterations to either the processor assembly or measurement device.
4Ease of operation
If existing LLCR measurement devices are used, then measurement capability is provided, but portability is limited
Solution Approach 1:
The measurement system is segmented into separate boards that can be independently transported and assembled as needed. This modular approach allows the components to be moved separately to different test locations and then quickly assembled for measurement, significantly improving portability while maintaining full measurement capability.
Solution Approach 2:
The patent transforms the measurement apparatus from a bulky three-dimensional device into flat, two-dimensional boards that can be easily transported, stored, and assembled. This dimensional transformation dramatically reduces the volume and footprint of the system while preserving all measurement functions, enabling high portability for field and laboratory use.
Data Source
AI summary
A low level contact resistance (LLCR) testing apparatus comprises a test board, an interface board, and a patch board. The test board comprises a processor socket. The interface board connects to both the test board and the patch board. The patch board connects to a contact resistance tester. An LLCR system comprising the LLCR testing apparatus and a contact resistance tester can be portable. The test board can accommodate thermal management solutions of varying sizes and types. Different test board designs can accommodate different socket-processor configurations and the different test boards can be easily accommodated by an LLCR testing apparatus due to its modular design.