Modular Load Lock Assembly for Reconfigurable Substrate Thermal Control

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Solution Overview

Problem

Customization of load locks in semiconductor processing systems to accommodate substrate heating and cooling requirements increases costs and complexity, complicates maintenance, and limits the reuse or redeployment of these systems.

Innovation Solution

A modular load lock arrangement with interchangeable components, including upper and lower heater/chill plates and actuator systems, allows for flexible configuration to meet heating, cooling, or constant temperature needs without customization, enabling efficient substrate processing and maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If load locks are customized to accommodate substrate heating and cooling requirements, then substrate processing requirements are satisfied, but costs and complexity increase

Engineering Contradiction:
Improvesubstrate processing requirements satisfactionVSAvoidload lock configuration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The load lock is divided into modular components including a load lock body, interchangeable heating assembly, and interchangeable cooling assembly. Each assembly can be independently installed or removed from the accessory seat, allowing the system to be segmented into different configurations based on processing requirements without redesigning the entire load lock.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The load lock accessory seat is designed with universal mounting features that can accommodate both heating assemblies and cooling assemblies through the same interface. This multi-functional design allows a single load lock body to serve multiple substrate processing functions by simply swapping assemblies, eliminating the need for customized load locks for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If load locks are customized for specific heating and cooling requirements, then processing operations are optimized, but maintenance complexity increases

Engineering Contradiction:
Improvesystem throughputVSAvoidmaintenance complexity
Core Design Contradiction:
ProductivityVSEase of repair

Solution Approach 1:

The heating and cooling functions are segmented into separate interchangeable assemblies that can be independently maintained. When maintenance is needed, only the specific assembly requiring service needs to be removed and replaced, rather than servicing the entire load lock system, thereby simplifying maintenance operations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interchangeable assembly design allows worn or malfunctioning heating or cooling assemblies to be quickly removed and replaced with serviceable assemblies. The removed assemblies can be sent for repair or replacement while the load lock remains operational with the other assembly, minimizing downtime and simplifying the repair process.

Inventive Principle:
Principle #34Discarding and recovering

3Adaptability or versatility

If load locks are customized with specific accessories, then substrate processing requirements are met, but redeployment and reuse are limited

Engineering Contradiction:
Improveprocessing operation requirementsVSAvoidredeployment and reuse flexibility
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The load lock body and accessory seat are designed with universal features that allow the same load lock to be deployed in different locations and configurations. By swapping the heating or cooling assemblies, the load lock can be redeployed to support different substrate processing operations at various fabs or facilities without requiring custom modifications for each deployment.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system transitions from a static, customized load lock configuration to a dynamic, reconfigurable system. The interchangeable assemblies can be added, removed, or swapped based on the specific processing requirements of different deployments, allowing the load lock to adapt dynamically to different operational needs throughout its service life.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces costs by eliminating the need for customizations, simplifies maintenance, and enhances the flexibility and reuse of load lock systems, improving system throughput and operational efficiency.

Implementation Method 1

one of an upper heater and an upper accessory seat blanking plate fixed to the upper accessory seat; one of a lower heater

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

one of an upper chill plate and an intermediate accessory seat blanking plate fixed to the intermediate accessory seat; one of a lower chill plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240178021A1Load lock arrangements, semiconductor processing systems having load lock arrangements, and methods of making load locks for semiconductor processing systems
Publication Date: 2024.05.30 ASM IP HLDG BV
  • US20240178021A1 patent drawing
  • US20240178021A1 patent drawing
  • US20240178021A1 patent drawing

AI summary

A load lock arrangement includes a load lock body having an upper plate member defining an upper accessory seat, an intermediate plate member spaced apart from the upper plate member and defining an intermediate accessory seat, and a lower plate member separated from the upper plate member by the intermediate plate member and defining a lower accessory seat. One of an upper heater and an upper accessory seat blanking plate is fixed to the upper accessory seat; one of an upper chill plate and an intermediate accessory seat blanking plate fixed to the intermediate accessory seat; and one of a lower chill plate, a lower heater, and a lower accessory seat blanking plate fixed to the lower accessory seat. Semiconductor processing systems, methods of making load lock arrangements, and material layer deposition methods are also described.