Modular Pressurized Workstation With Internal Wafer Handling

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Solution Overview

Problem

Current assembly line processes for semiconductor workpieces involve manual handling and movement between stations, leading to significant manufacturing overhead and inefficiencies due to the need for manual intervention and handling at ambient air pressure.

Innovation Solution

The implementation of a modular pressurized workstation with an internal material handling system that operates at a consistent atmospheric pressure, allowing for automated and controlled transport of semiconductor workpieces between modular tools, reducing manual intervention and improving efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manual handling and movement of semiconductor workpieces between stations is used at ambient air pressure, then ease of operation is maintained, but manufacturing overhead and time consumption increase significantly

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidmanufacturing cycle time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The patent replaces manual mechanical handling with an automated robotic system that operates within a pressurized enclosure. The robotic arm automatically transfers semiconductor workpieces between processing stations without human intervention, eliminating the need for manual handling while maintaining controlled atmospheric conditions throughout the workflow.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent implements a pressurized enclosure filled with controlled atmospheric pressure (inert or modified atmosphere) that contains all processing stations and material handling systems. This allows automated robotic operations to proceed without exposure to ambient air, reducing contamination risks while enabling continuous automated processing and minimizing manufacturing cycle time.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Ease of operation

If tools at different stations are spaced apart by significant distances, then ease of operation and accessibility are improved, but movement overhead and time consumption increase

Engineering Contradiction:

Improvetool accessibilityVSAvoidworkpiece transport time

Core Design Contradiction:

Ease of operationVSLoss of time

Solution Approach 1:

The patent transitions from horizontal spacing of tools to a vertical arrangement within a pressurized enclosure. Multiple processing stations are stacked vertically, allowing robotic arms to access tools at different heights while remaining within the same controlled atmosphere. This vertical integration reduces horizontal transport distances and enables faster workpiece transfer between stations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent merges multiple processing stations and tooling systems into a single integrated pressurized enclosure. All tools and processing equipment are housed within the same controlled environment, allowing the robotic system to transfer workpieces between stations without breaking the vacuum or pressure seal, thereby eliminating transport time penalties associated with atmospheric transitions.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If automated material handling systems are implemented, then manual handling errors are reduced, but device complexity and initial overhead increase

Engineering Contradiction:

Improvehandling accuracyVSAvoidsystem complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a universal robotic arm system that can perform multiple functions: picking up semiconductor workpieces, transferring them between different processing stations, placing them precisely at target locations, and navigating within the pressurized enclosure. This multi-functional robot reduces the need for specialized handling equipment at each station, thereby reducing overall system complexity while maintaining high reliability and precision.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces a pressurized enclosure as an intermediary environment that enables automated handling. The sealed enclosure with controlled atmosphere serves as a mediator between the external ambient environment and the internal automated processing system, allowing robotic operations to proceed without direct human intervention while maintaining consistent atmospheric conditions that protect sensitive semiconductor workpieces.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12272580B2Modular pressurized workstation

Publication Date: 2025.04.08 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.