Modular Magnetic Tracking Circuit Boards
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Solution Overview
Problem
Existing systems for tracking and determining the location of magnetic objects require larger sensing volumes, leading to increased costs, complexity, and poor applicability due to the use of single large-format printed circuit board assemblies.
Innovation Solution
A modular assembly and system design using processing, connecting, and sensing circuit boards, allowing for easy expansion by adding or removing modules, such as sensing and connecting circuit boards, to create a flexible and customizable sensing area without changing the entire architecture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If a single large-format printed circuit board assembly is used to provide a larger sensing volume, then the sensing volume is increased, but the manufacturing cost increases, device complexity increases, and applicability deteriorates
Solution Approach 1:
The assembly is divided into multiple separate circuit boards (processing circuit board, connecting circuit boards, sensing circuit boards) that can be independently manufactured and then coupled together. This segmentation allows each board to be produced using standard manufacturing processes rather than requiring a single large-format PCB, thereby reducing manufacturing complexity and cost while achieving a larger overall sensing volume when the boards are assembled together.
2Volume of stationary object
If a single large-format printed circuit board assembly is used to provide a larger sensing volume, then the sensing volume is increased, but the manufacturing cost increases
Solution Approach 1:
The assembly is divided into multiple separate circuit boards (processing circuit board, connecting circuit boards, sensing circuit boards) that can be independently manufactured and then coupled together. This segmentation allows each board to be produced using standard manufacturing processes rather than requiring a single large-format PCB, thereby reducing manufacturing complexity and cost while achieving a larger overall sensing volume when the boards are assembled together.
3Area of stationary object
If a single large-format printed circuit board assembly is used to provide a larger sensing area, then the sensing area is increased, but applicability deteriorates
Solution Approach 1:
The assembly is divided into multiple separate circuit boards that can be independently manufactured and then coupled together. This segmentation allows each board to be produced using standard manufacturing processes rather than requiring a single large-format PCB, thereby reducing manufacturing complexity and cost while achieving a larger overall sensing volume when the boards are assembled together.
Solution Approach 2:
The modular architecture with connecting circuit boards enables dynamic reconfiguration and scaling of the sensing area. Additional sensing circuit boards can be coupled to existing assemblies to expand the sensing volume for different applications, making the system adaptable and versatile rather than fixed in a single large-format configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design reduces manufacturing costs, improves applicability, and enhances tracking accuracy by sharing magnetic field measurements between assemblies, especially during transitions, thus extending the sensing volume efficiently.
Implementation Method 1
The provision of a plurality of magnetometers allows to measure a magnetic field associated with a magnetic object
Data Source
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AI summary
An assembly (10) for tracking and/or determining a location of at least one magnetic object (20) comprises a processing circuit board (110), at least one connecting circuit board (120), and at least one sensing circuit board (130) comprising at least one magnetometer (140). The at least one connecting circuit board (120) is mechanically and communicatively coupled with the processing circuit board (110), and the at least one sensing circuit board (130) is mechanically and communicatively coupled with the at least one connecting circuit board (120).