Modular Mainframe Layout for Parallel Semiconductor Substrate Processing
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Solution Overview
Problem
Existing substrate processing tools with a single linear robot in the mainframe provide limited expandability and processing throughput, especially when handling different types and sizes of substrates and chiplets.
Innovation Solution
A multi-chamber processing tool with modular automation modules, including transfer chambers and various process chambers, allows for the simultaneous handling and processing of multiple substrates and chiplets through a network of transfer robots, enabling parallel processing and expandability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single linear robot is used in the mainframe, then the device structure is simple, but the processing throughput and expandability are limited
Solution Approach 1:
The mainframe is divided into multiple modular automation modules (first automation module, second automation module, etc.), each containing independent process chambers (first process chamber, second process chamber, etc.). This segmentation allows parallel processing of multiple substrates simultaneously, significantly increasing throughput while maintaining manageable complexity through standardized module design.
Solution Approach 2:
The system transitions from a single linear robot operating in one dimension to multiple automation modules operating in parallel across multiple dimensions. Each module can process substrates independently, creating a multi-dimensional processing architecture that exponentially increases throughput capability.
2Adaptability or versatility
If multiple chambers or process modules are coupled to the mainframe, then processing capability is improved, but the mainframe length and device complexity increase
Solution Approach 1:
Multiple process chambers are nested within compact automation modules that are coupled to the EFEM in a space-efficient configuration. The modular design allows chambers to be arranged in a folded or nested manner rather than extending linearly, reducing the overall mainframe length while maintaining high processing capability.
3Adaptability or versatility
If different types of substrates are handled, then versatility is improved, but handling time and complexity increase
Solution Approach 1:
The automation modules are designed with universal interfaces and standardized buffer configurations that can accommodate multiple substrate types (first type of substrate, second type of substrate, etc.). The transfer robot and buffer system are configured to handle different substrate formats without requiring manual reconfiguration, enabling multi-functionality while maintaining efficient automated handling.
Data Source
AI summary
Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.