Modular Measuring Substrate for Semiconductor Process Monitoring
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Solution Overview
Problem
The high cost and operational inefficiencies associated with using wireless measuring substrates for monitoring factors affecting treatment states and carry operations in semiconductor manufacturing processes, due to the need for complex signal processing circuits and multiple sensors for various measurement types.
Innovation Solution
A modular substrate system where a first substrate with sensors is detachably stacked on a second substrate containing signal processing, power supply, and communication components, allowing for shared use across different types of measurements, reducing the need for multiple wireless substrates and lowering operational costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a wireless measuring substrate with signal processing circuits and communication circuits is used, then operation efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The measuring substrate is divided into two separate substrates: a first substrate that performs sensing functions and a second substrate that performs signal processing and communication functions. This segmentation allows each substrate to be optimized independently, reducing the complexity and cost of individual substrates while maintaining the overall functionality of the wireless measurement system.
Solution Approach 2:
The second substrate with signal processing and communication circuits is designed to work with multiple types of sensors and measurement configurations. This universal design allows a single second substrate to support various first substrates, reducing the need to manufacture multiple different wireless measuring substrates for different measurement types, thereby lowering overall manufacturing costs.
2Adaptability or versatility
If multiple types of sensors are mounted on separate wireless substrates, then measurement capability is improved, but device complexity and cost increase
Solution Approach 1:
The second substrate is designed as a universal platform that can interface with multiple types of first substrates containing different sensors (e.g., temperature sensors, acceleration sensors, gas flow sensors). This universal interface and processing architecture allows the system to perform various measurements without requiring separate complete wireless substrate designs for each sensor type, thereby reducing device complexity while maintaining versatile measurement capability.
Solution Approach 2:
The signal processing circuits and communication circuits for multiple sensor types are merged into a single second substrate. Instead of having separate wireless substrates for each sensor type, the system combines these processing functions into one shared substrate that can handle signals from various first substrates, reducing overall system complexity and component redundancy.
Data Source
AI summary
The present invention includes a first substrate having a sensor part for measuring a measured factor and a second substrate that is to be detachably stacked on a lower side of the first substrate, the second substrate including: a signal processing part that processes a measurement signal obtained by measurement by the sensor part; a power supply part for feeding power to the sensor part; and at least either a memory that stores measurement data obtained by being processed in the signal processing part or a communication part for transmitting the measurement data by wireless, wherein the second substrate is in common use for a plurality of kinds of first substrates different in measured factor measured by the sensor part from each other.