Modular Memory Device with Detachable Modules and Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current memory devices, such as SSDs, lack a modular design that allows for easy replacement and upgrading of memory modules, particularly in enterprise and data center environments, where flexibility and scalability are essential.
Innovation Solution
A modular memory device design featuring a connector plate with an edge connector for host connection, a controller plate with defined connection regions for memory modules, and a chassis for enclosure, enabling detachable and accessible memory modules with electrical communication through flexible cables or retention pins, ensuring compatibility with existing standards like SFF-TA-1002.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If memory devices use a fixed non-modular design, then structural simplicity is maintained, but flexibility and scalability for memory module replacement are reduced
Solution Approach 1:
The memory device is divided into distinct modular components: a connector plate with edge connector, a controller plate with controller module, and detachable memory modules. Each component can be independently replaced or upgraded, providing flexibility and scalability while maintaining manageable complexity through standardized interfaces.
Solution Approach 2:
The memory modules are designed to be detachably connected rather than permanently fixed, allowing dynamic reconfiguration of the memory device. Memory modules can be removed and replaced based on performance requirements, enabling the system to adapt to changing computational demands.
2Ease of repair
If memory modules are permanently integrated, then manufacturing precision is simplified, but ease of repair and upgrading is reduced
Solution Approach 1:
The controller plate is separated from the memory modules, with the controller remaining permanently mounted while memory modules are detachably connected. This segmentation allows memory modules to be easily replaced for repair or upgrading without affecting the controller or requiring replacement of the entire memory device.
Solution Approach 2:
A standardized connection region on the controller plate serves as an intermediary interface between the controller and detachable memory modules. This intermediary connection mechanism enables easy module replacement while maintaining reliable electrical connections, balancing ease of repair with connection reliability.
3Quantity of substance
If multiple memory modules are stacked vertically, then data storage capacity is increased, but heat dissipation challenges increase
Solution Approach 1:
Memory modules are arranged in a vertical stacking configuration along the z-axis, allowing multiple modules to be housed within a compact footprint. This vertical arrangement increases storage capacity without significantly increasing the device's planar dimensions, while heat can dissipate vertically through the stacked structure.
Solution Approach 2:
The patent incorporates heat management features that convert the heat generated by stacked memory modules into a manageable thermal flow pattern. Heat dissipation structures are designed to channel heat away from the stacked modules efficiently, transforming the potential harmful heat accumulation into a controlled thermal management system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances flexibility and scalability by allowing easy replacement and upgrading of memory modules, improving data storage capabilities while maintaining compatibility with existing systems, and incorporating heat management features for efficient operation.
Implementation Method 1
a heat conductive layer disposed between the first memory module and the second memory module
Implementation Method 2
a heatsink disposed on the memory control module
Data Source
AI summary
The present application provides a memory device. The memory device includes a connector plate having a front edge and a rear edge opposite to the front edge, wherein the connector plate comprises an edge connector disposed at the rear edge and configured to connect to a host connector of a host device; a controller plate defining a first connection region, a second connection region and a chip region, wherein the controller plate is attached to the connector plate at the first connection region, and the controller plate comprises a memory control module disposed in the chip region and in electrical communication with the edge connector; and at least one memory module detachably connected to the controller plate at the second connection region of the controller plate, wherein each of the at least one memory module is in electrical communication with the memory control module when the memory module is connected to the controller plate, such that the memory module can be accessible by the host device via the memory control module.