Modular Memory Die Layouts for Flexible Wafer Partitioning
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Solution Overview
Problem
Conventional semiconductor wafer layouts for memory dies are limited in configuration flexibility, leading to yield limitations and die configuration constraints, which restrict the formation of various memory die configurations from a single wafer design.
Innovation Solution
A modular die configuration approach where a semiconductor wafer is patterned with memory arrays and channels, allowing for multiple possible layouts by grouping memory arrays and channels into independently operable units, enabling the formation of different memory die configurations by varying the separation regions, thereby allowing for diverse die configurations from a single wafer design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional semiconductor wafer layouts are used for memory dies, then manufacturing process is simplified, but configuration flexibility is limited and yield is restricted
Solution Approach 1:
The wafer layout is segmented into multiple independently operable units, each containing a subset of memory arrays and associated control circuitry. These units can be independently configured and separated during fabrication, allowing flexible die configurations to be formed from a single wafer while maintaining simplified manufacturing processes for each unit.
Solution Approach 2:
The wafer layout is designed with universal structures that can serve multiple functions - the same wafer can be configured to produce different die configurations (e.g., single-die, multi-die, stacked configurations) by varying how the independently operable units are grouped and connected. This multi-functionality resolves the contradiction between adaptability and complexity.
2Productivity
If fixed die configurations are used from single wafer design, then manufacturing process is simplified, but yield is limited due to configuration constraints
Solution Approach 1:
The wafer layout incorporates dynamic configurability where the same physical wafer can be dynamically assigned to different die configurations based on manufacturing yield requirements. Independently operable units can be selectively activated or deactivated, and their interconnections can be configured differently, allowing the system to adapt to yield variations without requiring new wafer designs.
Solution Approach 2:
The patent changes the parameter of die configuration by varying the grouping and interconnection of independently operable units from a single wafer layout. By changing how units are combined (e.g., 1 die per wafer, 2 dies per wafer, stacked configurations), the system achieves multiple die configurations from the same wafer design, thereby improving yield without sacrificing configuration variety.
3Quantity of substance
If multiple die configurations are formed from single wafer, then storage density and throughput are increased, but manufacturing complexity increases
Solution Approach 1:
The wafer is divided into independently operable units that can be independently manufactured and tested. This segmentation allows multiple die configurations to be formed from a single wafer by differentially connecting these units, increasing storage density and throughput without requiring complex monolithic structures. Each unit maintains relatively simple internal architecture.
Solution Approach 2:
The patent implements nesting by placing multiple independently operable units within a single wafer structure, where each unit can be further divided into sub-units. This nested arrangement allows for scalable configuration - units can be individually activated or combined to achieve different storage densities and throughput levels without increasing the overall wafer structure complexity beyond manageable levels.
Data Source
AI summary
Methods, systems, and devices for modular die configurations for multi-channel memory are described. A semiconductor component (e.g., a semiconductor wafer) may be configured with multiple rows and multiple columns of memory arrays, and associated channels. A row of memory arrays may be associated with a contact region extending along the row direction. The semiconductor component may also include control regions extending along the column direction between at least some of the columns of memory arrays. Each control region may include control circuitry for operating memory arrays on one or both sides of the control region. The channels and memory arrays of the semiconductor wafer may be grouped into one or more independently-operable memory dies, with each memory die having at least a portion of a control region and at least a portion of a contact region for operating the memory arrays of the memory die.