Modular Memory Socket with Removable Cover for Safe Access
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Solution Overview
Problem
Users face challenges when replacing memory components in computer systems, as existing designs require removing significant parts or entire panels, risking damage to internal systems and complicating access due to protective layers and complex circuitry.
Innovation Solution
A modular memory component system with a support plate and load plate that allows for easy access and replacement of memory packages without removing the entire panel, utilizing alignment couplings and a heat spreader for efficient thermal management, and a removable cover for user access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the entire panel or significant parts are removed to access memory components, then the memory component is accessible for replacement, but the risk of damaging internal systems increases and the complexity of access increases
Solution Approach 1:
The patent divides the computer system into distinct segments: a removable cover, a support plate with memory socket, and the main system body. The cover can be independently removed to access the memory component without requiring removal of the entire panel or exposure of other internal components. This segmentation allows targeted access while protecting the rest of the system.
Solution Approach 2:
The memory component is extracted as a separate, replaceable element that can be accessed through a dedicated opening in the support plate. The cover is also extracted as a separate removable component that provides access to the memory socket without exposing other internal systems. This extraction allows the memory component to be serviced independently.
2Reliability
If protective materials are added to protect internal systems, then the safety of internal components is improved, but the dimensions and complexity of internal components increase
Solution Approach 1:
The patent creates a segmented design where the support plate with memory socket is separated from the main system body by a removable cover. This segmentation allows the memory component to be accessed through a dedicated interface without requiring removal of protective materials from other internal components, maintaining protection while simplifying access.
Solution Approach 2:
The removable cover acts as an intermediary element between the user and the memory component. It provides a controlled access path that allows memory replacement without exposing other internal components to potential damage, thus maintaining protection while simplifying the access process.
3Adaptability or versatility
If the memory component is made replaceable, then the adaptability and upgradability are improved, but the structural complexity of the system increases
Solution Approach 1:
The patent segments the memory system into a removable cover, support plate with socket, and memory component. This segmentation enables easy replacement of the memory component while keeping the overall structural complexity low through standardized interfaces and simple assembly/disassembly mechanisms.
Solution Approach 2:
The support plate and cover design serves multiple functions: it protects the memory socket, provides access for replacement, and maintains structural integrity. This multi-functionality reduces the need for additional specialized components, thereby reducing overall structural complexity while maintaining replaceability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables safe and efficient replacement of memory components without damaging internal systems, reduces complexity in accessing the memory socket, and improves thermal management for enhanced processing speed.
Implementation Method 1
utilizing alignment couplings and a heat spreader for efficient thermal management
Data Source
AI summary
An electronic system has a printed circuit board and a substrate. The substrate has two sides, a top and bottom. At least one memory unit is connected to the bottom side of the substrate and at least one processor is connected to the top side of the substrate. The memory is connected to the processor with interconnects that pass through the substrate.


