Modular Microphone Array With Heat-Free Connections
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Solution Overview
Problem
Beamforming microphone arrays face challenges in achieving sufficient acoustical performance due to parameter mismatch across microphone elements, particularly in MEMS microphones, which require better matching across the full audio range for advanced algorithms.
Innovation Solution
A modular microphone module design featuring a first circuit board with multiple secondary circuit boards, each mounting a microphone, allowing for selection and electronic coupling via heat-free connections like pin headers or flexible cables, enabling precise matching of acoustic characteristics and minimizing frequency response alterations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If microphones are soldered directly to a common circuit board, then manufacturing is simplified, but parameter mismatch across microphone elements increases
Solution Approach 1:
The system divides the microphone assembly into separate modules, with each microphone mounted on its own secondary circuit board. This segmentation allows individual microphone selection and matching based on acoustic characteristics while maintaining ease of assembly through modular construction.
2Ease of manufacture
If heat-based soldering connections are used to attach circuit boards, then electrical coupling is achieved, but frequency response characteristics are altered
Solution Approach 1:
The microphones are pre-mounted on secondary circuit boards and pre-matched for acoustic characteristics before final assembly. This preliminary action allows selection of microphones with matching frequency responses before they are permanently attached to the main circuit board.
Solution Approach 2:
The patent introduces an intermediary selection process where microphones are characterized and matched based on their frequency responses before assembly. This intermediary step acts as a mediator between the manufacturing process and the final acoustic performance, ensuring matched characteristics.
3Manufacturing precision
If microphones are selected and matched before assembly, then acoustic characteristics are improved, but manufacturing complexity increases
Solution Approach 1:
By segmenting the assembly into modular units with microphones pre-mounted on secondary circuit boards, the system enables straightforward matching and selection processes. The modular structure reduces the complexity of handling and assembling individual matched components.
Data Source
AI summary
The disclosure relates to a system, comprising a first circuit board comprising a control circuitry configured to control a beamforming array of microphones, and multiple second circuit boards attached to the first circuit board, each one of the multiple second circuit boards mounting a microphone of the array of microphones.