Modular Microsatellite Architecture for Rapid Deployment

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Solution Overview

Problem

The current methods for manufacturing microsatellites are time-consuming and costly due to the traditional design, development, and testing approach, which is not optimized for rapid deployment in missions with short notice or limited budgets, such as tactical military operations or sudden monitoring requirements.

Innovation Solution

A modular architecture for microsatellites comprising three types of modules: electronic functional trays for housing electronic boards, volumetric functional trays for 3D devices, and geometric functional trays for heat dissipation and interface points, allowing for flexible stacking and configuration based on mission requirements, reducing design effort and manufacturing time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional design, development and testing approach is used for each satellite, then the satellite is optimally designed for its specific mission, but the manufacturing time and costs become extremely high and the process takes 24-30 months

Engineering Contradiction:
Improvemission-specific optimizationVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The satellite is divided into modular functional units (payload module, platform module, propulsion module, power module, etc.) that can be independently designed, tested, and assembled. Each module serves a specific function and can be reused across different satellite missions, dramatically reducing development time while maintaining mission-specific performance through modular configuration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Standardized modules are designed to be universally applicable across multiple satellite missions. The platform module, propulsion module, and other standardized components can be reused for different satellite types (microsatellites, nanosatellites, cubesats), reducing redundant development work while allowing mission-specific customization through module selection and configuration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional design, development and testing approach is used for each satellite, then the satellite is optimally designed for its specific mission, but the costs become extremely high

Engineering Contradiction:
Improvemission-specific optimizationVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By segmenting the satellite into standardized modules, development costs are amortized across multiple missions. Each module can be independently tested and certified once, then reused without repeating expensive testing procedures, significantly reducing per-mission costs while maintaining mission-specific performance through appropriate module selection.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Universally designed modules can serve multiple mission types, allowing the same propulsion module, power module, or platform module to be used across different satellite programs. This universality reduces tooling costs, testing expenses, and development overhead while maintaining mission-specific optimization through modular configuration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If traditional design, development and testing approach is used, then the satellite can meet specific mission requirements, but the manufacturing time scale is too long for tactical military operations or short-notice monitoring requirements

Engineering Contradiction:
Improvemission requirement fulfillmentVSAvoiddevelopment time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

Standardized modules are pre-designed, pre-tested, and pre-certified before actual satellite assembly. The platform module, propulsion module, power module, and other standardized components undergo complete testing and validation in advance, so that when a new satellite mission is initiated, these modules can be quickly assembled and integrated without repeating the lengthy testing process, enabling rapid deployment for time-critical missions.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Segmentation into standardized modules allows parallel development and testing of individual modules, which can then be rapidly assembled into complete satellites. This modular approach reduces the critical path of development by allowing independent module preparation and reducing system-level integration and testing time, enabling fulfillment of tight deadlines for tactical operations.

Inventive Principle:
Principle #1Segmentation

4Productivity

If pre-existing solutions are reused for new missions, then some development work can be avoided, but modifications are still required and new tests are needed

Engineering Contradiction:
Improvedevelopment efficiencyVSAvoidmodification and testing requirements
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The standardized modules are designed with universal interfaces and standardized mounting configurations that allow direct interchange between different satellite missions without requiring modifications. Each module maintains its functionality across multiple applications, and the universal interface standards eliminate the need for custom adaptation work, reducing both modification complexity and testing requirements while maintaining high development efficiency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10906671B2Modular architecture optimized for making microsatellites
Publication Date: 2021.02.02 FONDAZIONE GRAN SASSO TECH
  • US10906671B2 patent drawing
  • US10906671B2 patent drawing
  • US10906671B2 patent drawing

AI summary

The present invention concerns a method for making a microsatellite, comprising providing: modules of a first type configured to house electronic boards of a microsatellite; modules of a second type configured to house devices and systems of a microsatellite; and modules of a third type comprising first and second interface means configured to be coupled to a launch vehicle and to external appendages of a microsatellite, respectively; said modules of a third type being designed to cause a body of a microsatellite to have a predefined height; wherein all the modules of the first, second and third types are configured to be stacked regardless of the type. The method further comprises making a body of a microsatellite by stacking modules of different types, wherein the stacked modules include at least one module of the second type and at least one module of the third type.