Modular Millimeter Wave Antenna Array Packages
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Solution Overview
Problem
Forming large-scale antenna arrays with hundreds to thousands of planar elements poses challenges in design and assembly, particularly in millimeter wave imaging systems where minimal atmospheric absorption frequencies and short-distance detection requirements need to be met.
Innovation Solution
The use of array packages comprising bottom dielectric layers, an array of antennas, a conductive ground plane layer, and an orthogonal conductive surface, which can be electrically connected to form large-scale antenna arrays by coupling multiple packages together, allowing for efficient assembly and operation at millimeter wave frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large-scale antenna arrays with hundreds to thousands of planar elements are formed directly, then the system can operate at millimeter wave frequencies, but the design and assembly complexity increases significantly
Solution Approach 1:
The large-scale antenna array is divided into multiple smaller sub-arrays, each contained within a separate array package. Each sub-array includes a manageable number of antenna elements (e.g., 4x4 or similar configurations), which are then combined to form the complete large-scale array. This segmentation reduces the complexity of individual package design and assembly while achieving the required large aperture for millimeter wave operation.
Solution Approach 2:
Multiple array packages are nested or stacked together to form the complete large-scale antenna array system. The packages can be arranged in various configurations (e.g., stacked vertically or arranged in a larger grid pattern), with each package containing complete antenna elements and associated circuitry. This nested structure allows modular assembly where smaller functional units combine to create the larger system.
2Adaptability or versatility
If multiple array packages are electrically coupled together to form large-scale arrays, then the system scalability improves, but the manufacturing and alignment precision requirements increase
Solution Approach 1:
The array packages incorporate ground plane layers and conductive surfaces that are electrically connected through eutectic solder joints, creating equipotential reference planes across multiple packages. The ground plane layers are positioned at consistent potentials and interconnected through controlled impedance paths, ensuring electrical continuity and phase coherence across the entire array while simplifying alignment requirements.
Solution Approach 2:
The invention utilizes eutectic soldering with specific melting point characteristics to join array packages. The eutectic composition (typically锡铅合金 with specific ratios) provides a sharp melting point that enables precise thermal control during assembly, allowing for automated pick-and-place mounting with high positioning accuracy. The solder joint properties are optimized to provide both mechanical strength and electrical continuity.
3Reliability
If array packages are assembled using eutectic solder for electrical continuity, then the electrical connection reliability improves, but the assembly process complexity increases
Solution Approach 1:
The array packages are pre-assembled with ground plane layers and conductive surfaces prepared for soldering before final integration into the large-scale array. The packages arrive at the assembly stage with pre-formed solder pads, pre-positioned ground planes, and pre-tested electrical connections within each package. This preliminary preparation enables rapid final assembly using automated eutectic soldering processes.
Solution Approach 2:
The invention replaces manual or mechanical connection methods with eutectic soldering for joining array packages. The soldering process utilizes controlled thermal fields to create reliable metallurgical bonds between packages, replacing less reliable mechanical fastening or welding methods. The eutectic composition enables automated soldering processes with precise temperature control, improving both reliability and manufacturability.
Data Source
AI summary
Array packages and methods for forming large-scale antenna arrays. One method includes aligning two or more array packages. The two or more array packages each include one or more bottom dielectric layers, an array of antennas arranged in a plane above the one or more bottom dielectric layers, a ground plane layer above the one or more bottom dielectric layers, and a conductive surface on at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas. The conductive surface is electrically connected to the ground plane layer.