Modular MIMO Antenna Assembly for Rapid Radiation Pattern Evaluation
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Solution Overview
Problem
Existing antenna configurations for radar and communication systems are inflexible and costly to modify, requiring redesign and replacement of high-frequency boards to adjust radiation characteristics, limiting the evaluation of different antenna types and characteristics.
Innovation Solution
A modular antenna arrangement featuring a circuit board with a chipset for transmitting and receiving high-frequency electromagnetic waves, coupled with unbundling components that guide waves to specific transfer points, allowing for interchangeable antenna positions and types without the need for additional logic components or electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional logic components and electrical connections are provided for interchangeable antenna positions, then antenna configuration flexibility is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the antenna elements from the circuit board and makes them interchangeable components. The antenna positions are decoupled from the circuit board, allowing antennas to be freely replaced without modifying the board itself or adding complex electrical connections. This resolves the contradiction by achieving flexibility through component extraction rather than through additional logic and connections.
Solution Approach 2:
The circuit board is designed with universal mounting structures that can accommodate different antenna types and configurations without requiring additional logic components or electrical connections. The same board can support multiple antenna arrangements, achieving versatility through universal design rather than through added complexity.
2Adaptability or versatility
If additional logic components and electrical connections are provided for interchangeable antenna positions, then antenna configuration flexibility is improved, but manufacturing cost increases
Solution Approach 1:
By extracting antennas as separate interchangeable components and eliminating the need for additional logic components and electrical connections, the patent simplifies the manufacturing process. The circuit board becomes a universal platform that requires no custom modifications for different antenna configurations, significantly reducing manufacturing costs while maintaining flexibility.
Solution Approach 2:
The system is segmented into a universal circuit board platform and interchangeable antenna components. This segmentation allows the board to be manufactured once with universal mounting features, while only the antenna elements need to be varied for different configurations, reducing overall manufacturing complexity and cost.
3Adaptability or versatility
If the entire system is replaced to adjust radiation pattern, then antenna configuration flexibility is improved, but loss of time and manufacturing cost increase
Solution Approach 1:
The patent extracts only the antenna elements as the replaceable components, allowing the radiation pattern to be adjusted by swapping antennas alone. This eliminates the need to replace the entire system or redesign the circuit board, significantly reducing development time and resource expenditure while maintaining full configurability.
Solution Approach 2:
The system is designed to be dynamically reconfigurable through simple antenna replacement. The universal mounting platform enables rapid swapping of antenna elements to adjust radiation patterns, transforming a static system into a dynamic one that can adapt quickly without extensive redesign or rework.
4Adaptability or versatility
If the entire system is replaced to adjust radiation pattern, then antenna configuration flexibility is improved, but manufacturing cost increases
Solution Approach 1:
By extracting and making only the antenna elements replaceable rather than the entire system, the patent achieves radiation pattern adjustment through simple component swaps. This dramatically reduces manufacturing costs as the circuit board and other system components can be reused across different configurations, eliminating the need for costly complete system replacements.
Solution Approach 2:
The design allows the circuit board and supporting infrastructure to be recovered and reused across multiple antenna configurations. Only the antenna elements are discarded and replaced when changing radiation patterns, maximizing resource utilization and minimizing manufacturing costs while maintaining full adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible and cost-effective evaluation of various antenna types and characteristics by using interchangeable unbundling components, reducing the complexity and expense of modifying antenna systems, and facilitating the testing of new antenna configurations, including 3D-printed antennas, without the need for network analyzers or screws.
Implementation Method 1
routing component (4) for placement on the circuit board (2) to guide the electromagnetic wave emanating from the circuit board (2) to a transfer point (5) of the routing component (4) and/or to guide the electromagnetic wave received at a transfer point (5) of the routing component (4) to the circuit board (2)
Data Source
Figure 1~2
AI summary
The present invention relates to a modular antenna arrangement (1), in particular a modular MIMO antenna arrangement, for evaluating different antenna arrangement characteristics, and comprises a printed circuit board (2) with a chipset (3) for transmitting and/or receiving a high-frequency electromagnetic wave, and at least one routing component (4) for mounting on the printed circuit board (2) to direct the electromagnetic wave emanating from the printed circuit board (2) to a transfer point (5) of the routing component (4) and/or the electromagnetic wave received at a transfer point (5) of the routing component (4) to the printed circuit board (2).