Modular MIMO Antenna Array for Fast Radiator Reconfiguration
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Solution Overview
Problem
Existing modular antenna arrays are costly and time-consuming to reconfigure for different antenna characteristics, as they require replacing and re-soldering components, limiting the evaluation of various antenna types and positions.
Innovation Solution
A modular antenna array with a printed circuit board and unbundling components that guide high-frequency electromagnetic waves, allowing for interchangeable transceiver components without additional logic modules or electrical connections, enabling flexible antenna configurations and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional modular antenna arrays are reconfigured for different antenna characteristics, then different antenna types can be evaluated, but the process becomes costly and time-consuming due to component replacement and re-soldering
Solution Approach 1:
The antenna array is divided into independent modular elements (radiators) that can be individually exchanged. Each radiator is a separate component that can be mounted or removed from the evaluation board without affecting other components, enabling quick reconfiguration between different antenna types and positions.
Solution Approach 2:
A single evaluation board is designed to support multiple antenna configurations through universal mounting structures and interfaces. The same base board can accommodate various radiator types (printed circuit board antennas, wire antennas, 3D-printed antennas) without requiring board replacement or complex reconfiguration.
2Adaptability or versatility
If traditional modular antenna arrays are reconfigured for different antenna characteristics, then different antenna types can be evaluated, but the process becomes costly due to component replacement and re-soldering
Solution Approach 1:
The antenna system is segmented into a permanent evaluation board and exchangeable radiator components. This segmentation eliminates the need for costly re-soldering operations, as radiators are mechanically mounted using standardized interfaces that allow tool-free or simple tool-based attachment and detachment.
Solution Approach 2:
The radiators are designed as inexpensive, easily replaceable components that can be manufactured using low-cost methods (printed circuit board fabrication, wire bending, 3D printing). Their low cost enables frequent exchange without significant investment, making the evaluation process economically efficient.
3Adaptability or versatility
If evaluation platforms use multiple circuit boards that must be plugged together, then antenna configurations can be adjusted by replacing the high-frequency board, but the baseband/supply board must be reused requiring costly and time-consuming reconfiguration
Solution Approach 1:
The evaluation board integrates the baseband processing and power supply functions into a single permanent platform, eliminating the need for separate circuit board assemblies. This merged design provides a stable foundation that does not require reconfiguration when changing antenna characteristics, reducing overall system complexity.
Solution Approach 2:
The evaluation board is designed as a universal platform that supports multiple antenna configurations through standardized interfaces and mounting structures. The same board can evaluate different radiator types without requiring replacement of any subsystem components, simplifying the reconfiguration process to a single component exchange.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient evaluation of different antenna types and positions without the need for extensive reconfiguration, reducing costs and simplifying the process of testing various antenna configurations, including 3D-printed antennas, by using a unified printed circuit board with interchangeable unbundling and transceiver components.
Implementation Method 1
at least one unbundling component (4) for mounting on the printed circuit board (2) to guide the electromagnetic wave emitted from the printed circuit board (2) to a transfer point (5) of the unbundling component (4) and/or to guide the electromagnetic wave received at a transfer point (5) of the unbundling component (4) to the printed circuit board (2)
Data Source
AI summary
The present disclosure relates to a modular antenna array, in particular a modular MIMO antenna array, for evaluating different antenna array characteristics, and comprises a printed circuit board with a chipset for transmitting and/or receiving a high-frequency electromagnetic wave, and at least one unbundling component for mounting on the printed circuit board to guide the electromagnetic wave emitted from the printed circuit board to a transfer point of the unbundling component and/or to guide the electromagnetic wave received at a transfer point of the unbundling component to the printed circuit board.