Modular MIPI Test Board Layout for Reusable Chip Validation
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Solution Overview
Problem
Existing technologies lack a dedicated device or system for mobile industry processor interface (MIPI) tests, requiring technicians to rebuild platforms each time, leading to inconsistent and error-prone test results.
Innovation Solution
A testing device and system featuring a circuit mainboard with detachable chip and signal carrier boards, power connectors, and a temperature control apparatus, allowing easy modification and replacement of components to meet MIPI testing requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If technicians use existing materials at hand or past experience to build test platforms, then they can conduct MIPI tests without dedicated equipment, but they must re-build the platform each time which causes difficulties and errors
Solution Approach 1:
The test platform is divided into modular components including a baseboard, chip carrier boards for different chip types, and signal carrier boards for various signal interfaces. Each module can be independently selected and combined based on specific test requirements, eliminating the need to rebuild entire platforms while reducing complexity through standardized interfaces
Solution Approach 2:
The baseboard is designed with universal interfaces and multiple carrier board slots that can accommodate different types of chip and signal carrier boards. This multi-functional design allows a single baseboard to support various MIPI test configurations by simply changing the carrier boards, providing both adaptability and reduced complexity
2Adaptability or versatility
If a dedicated MIPI test device is designed with modular carrier boards, then adaptability to different test requirements is improved, but device structure becomes more complex
Solution Approach 1:
The system is segmented into a baseboard and detachable carrier boards with standardized connection interfaces. This segmentation allows complex functionality to be distributed across simple, interchangeable modules, maintaining adaptability while managing structural complexity through modular design
Solution Approach 2:
The carrier boards are designed to be inserted into and nested within the baseboard structure. The chip carrier boards contain the chips under test, which are further connected to signal carrier boards that interface with the baseboard. This nested arrangement provides adaptability through multiple levels of modularity while containing structural complexity within standardized connector interfaces
Data Source
AI summary
A testing device and a testing system are provided. The testing device includes a circuit mainboard. One side of the circuit mainboard includes a plurality of chip sockets, a plurality of power connectors, and a plurality of signal output connectors. A chip under test is detachably fixed on a chip carrier board. An external power supply can provide power to the chip under test on the chip carrier board through the power connectors and the circuit mainboard. Another side of the circuit mainboard a plurality of carrier board connectors. Each of signal carrier boards can be detachably disposed on the circuit mainboard through the carrier board connectors. Each of the signal carrier boards has a signal input connector and a connector at one end of a signal input line plugs into the signal input connectors.