Modular MMW Power Source Spatial Combining
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Solution Overview
Problem
High power sources for W-band millimeter wave (MMW) applications are typically bulky, expensive, and non-portable due to the use of magnetrons or gyrotrons, while semiconductor devices offer limited power output, necessitating the development of more efficient power combining methods.
Innovation Solution
A power source module comprising a plurality of submodules with circuit devices, including amplitude adjusters, phase shifters, and amplifiers, connected through power dividers and radiating elements, which spatially combine MMW wavefronts to enhance power output and portability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If tube-based sources (magnetrons or gyrotrons) are used for high power MMW output, then power output is improved, but device size and weight increase making the system bulky and non-portable
Solution Approach 1:
The patent divides the high-power MMW source into multiple lower-power semiconductor amplifier modules arranged in an array. Each module generates a portion of the total power, and the individual outputs are combined spatially to achieve the required high power output. This segmentation allows the system to reach high power levels without requiring a single large, heavy tube-based source.
2Power
If tube-based sources (magnetrons or gyrotrons) are used for high power MMW output, then power output is improved, but device complexity and cost increase
Solution Approach 1:
The system is segmented into multiple identical or modular amplifier modules, each using solid-state semiconductor technology. This modular approach simplifies the overall system architecture compared to a single complex tube-based source, as each module can be designed and manufactured using standard solid-state techniques, reducing individual module complexity and enabling easier integration.
Solution Approach 2:
Multiple low-power semiconductor amplifier outputs are merged spatially through coherent or incoherent combination to produce the required high power output. This combining approach allows the system to achieve high power levels while using simpler, lower-cost solid-state devices rather than complex high-power tubes.
3Weight of moving object
If semiconductor devices are used for MMW generation, then device size and portability are improved, but power output is limited to only a few watts per device
Solution Approach 1:
The patent combines the power outputs of multiple semiconductor devices spatially to achieve high total power output. By arranging multiple low-power amplifiers in an array and combining their outputs through appropriate coupling structures, the system achieves high power levels (sufficient for W-band applications) while maintaining the advantages of solid-state technology including compact size and portability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of a compact, high-power MMW source that overcomes the limitations of traditional tube-based systems, offering improved power output and portability for W-band applications.
Implementation Method 1
spatially combine the power output from a large plurality of semiconductor devices within a waveguide or in free space
Data Source
AI summary
A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.