Modular mmWave RFIC-Antenna Assembly for Beam Coverage

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Solution Overview

Problem

The challenge in implementing a millimeter-wave (mmWave) antenna array in electronic devices is the limited space available due to the need for full spherical beam coverage, which is obstructed by conductive housing and display, making it difficult to achieve sufficient beam coverage while maintaining performance.

Innovation Solution

A modular mmWave assembly comprising a first mmWave module with an RF integrated circuit and a second mmWave module with an antenna array, connected by a releasable connector that allows for flexible placement and interconnection, enabling efficient signal transmission and adaptation to available space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional mmWave antenna array is arranged next to the display in the same module, then the beam coverage performance is improved, but the device space is insufficient and the display area is reduced

Engineering Contradiction:
Improvebeam coverage performanceVSAvoiddisplay area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent divides the mmWave system into two separate modules: an RF active circuit module and an antenna array module. This segmentation allows the antenna array to be positioned in available device space away from the display, maintaining beam coverage performance while preserving full display area. The mechanical separation resolves the space conflict by distributing components to different locations within the device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional planar arrangement (antenna array next to display on the same plane) to a three-dimensional distributed arrangement. The antenna array can be positioned in different spatial locations and orientations within the device volume, utilizing vertical space and alternative planes to achieve sufficient beam coverage without encroaching on the display area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If the mmWave antenna array size is reduced to fit available space, then the device space constraint is satisfied, but the beam coverage performance is impaired

Engineering Contradiction:
Improveavailable spaceVSAvoidbeam coverage performance
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

By separating the antenna array from the RF circuitry, the patent enables the antenna array to be positioned in previously unused device spaces. This mechanical separation allows the antenna array to maintain its required size and configuration for adequate beam coverage, while the compact RF module occupies a different spatial location, thus satisfying both space constraints and performance requirements.

Inventive Principle:
Principle #1Segmentation

3Area of stationary object

If a distributed antenna array is implemented with mechanical separation between RF circuitry and antenna, then the available space is utilized efficiently, but the assembly complexity increases

Engineering Contradiction:
Improvespace utilizationVSAvoidassembly complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent employs a universal connector design that standardizes the interconnection between the RF active circuit module and the antenna array module. This universal interface simplifies the assembly process by providing a repeatable, pre-defined connection mechanism, reducing the complexity that would otherwise arise from custom wiring and alignment procedures for the distributed arrangement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11855350B2Millimeter-wave assembly
Publication Date: 2023.12.26 HUAWEI TECH CO LTD
  • US11855350B2 patent drawing
  • US11855350B2 patent drawing
  • US11855350B2 patent drawing

AI summary

A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.